公开(公告)号：US20130260058A1

公开(公告)日：2013-10-03

申请号：US13764340

申请日：2013-02-11

Applicant: PLASTIC LOGIC LIMITED

Inventor： Thomas Meredith Brown ,  Henning Sirringhaus ,  Devin John Mackenzie

IPC: B05D5/12 ,  B05D3/14 ,  B05D1/32

CPC classification number: B05D5/12 ,  B05D1/322 ,  B05D3/145 ,  B82Y10/00 ,  B82Y30/00 ,  H01L51/0016 ,  H01L51/0017 ,  H01L51/0021 ,  H01L51/0022 ,  H01L51/0023 ,  H01L51/0036 ,  H01L51/0037 ,  H01L51/0039 ,  H01L51/0043 ,  H01L51/052 ,  H01L51/0525 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/057 ,  H01L51/105 ,  H01L2251/105 ,  Y10S977/887

Abstract: A method for forming an electronic device having a multilayer structure, comprising: embossing a surface of a substrate so as to depress first and second regions of the substrate relative to at least a third region of the substrate; depositing conductive or semiconductive material from solution onto the first and second regions of the substrate so as to form a first electrode on the first region and a second electrode on the second region, wherein the electrodes are electrically insulated from each other by the third region.

Abstract translation: 一种形成具有多层结构的电子器件的方法，包括：对衬底的表面进行压花，以相对于衬底的至少第三区域压下衬底的第一和第二区域; 将溶液中的导电或半导体材料沉积到衬底的第一和第二区域上，以在第一区域上形成第一电极，在第二区域上形成第二电极，其中电极通过第三区域彼此电绝缘。