公开(公告)号：US20220320063A1

公开(公告)日：2022-10-06

申请号：US17407174

申请日：2021-08-19

Applicant: POWERTECH TECHNOLOGY INC.

Inventor： Pei-Hsun Chou ,  Ko-Lun Liao

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A package structure and a manufacturing thereof are provided. The package structure includes a base, a chip, a control element and an underfill. The chip is disposed on the base and includes a recess, and the recess has a bottom surface and a sidewall. The control element is disposed between the base and the chip and disposed on the bottom surface of the recess, and a gap exists between the control element and the sidewall of the recess. The underfill is disposed in the recess. The chip and the control element are electrically connected to the base respectively.

公开(公告)号：US11848318B2

公开(公告)日：2023-12-19

申请号：US17407174

申请日：2021-08-19

Applicant: POWERTECH TECHNOLOGY INC.

Inventor： Pei-Hsun Chou ,  Ko-Lun Liao

IPC: H01L25/18 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2224/32225

Abstract: A package structure and a manufacturing thereof are provided. The package structure includes a base, a chip, a control element and an underfill. The chip is disposed on the base and includes a recess, and the recess has a bottom surface and a sidewall. The control element is disposed between the base and the chip and disposed on the bottom surface of the recess, and a gap exists between the control element and the sidewall of the recess. The underfill is disposed in the recess. The chip and the control element are electrically connected to the base respectively.