公开(公告)号：US20230110079A1

公开(公告)日：2023-04-13

申请号：US17821168

申请日：2022-08-20

Applicant: POWERTECH TECHNOLOGY INC.

Inventor： Pei-chun Tsai ,  Hung-hsin Hsu ,  Ching-wei Liao ,  Shang-yu Chang Chien

IPC: H01L25/16 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498

Abstract: A fan-out package structure and a manufacturing method thereof are provided. The fan-out package structure includes an upper redistribution layer, a die, a passive element, and an active element. The upper redistribution layer includes a first surface and a second surface opposite to the first surface. The die is disposed on the first surface of the upper redistribution layer and is electrically connected to the upper redistribution layer. The passive element is disposed on the second surface of the upper redistribution layer and is electrically connected to the upper redistribution layer. The active element is disposed on the second surface of the upper redistribution layer and is electrically connected to the upper redistribution layer. The active element is laterally adjacent to the passive element, and the die is electrically connected to the active element and the passive element through the upper redistribution layer.