公开(公告)号：US20210257231A1

公开(公告)日：2021-08-19

申请号：US16920409

申请日：2020-07-02

Applicant: POWERTECH TECHNOLOGY INC.

Inventor： Shinichi Sakurada

IPC: H01L21/67 ,  H01L21/683

Abstract: A semiconductor manufacturing apparatus includes a supporting stage for mounting a semiconductor wafer with a protective member attached thereto, a pressing device for pressing the semiconductor wafer with a protective member attached thereto, an ultraviolet irradiation device, and a chamber for housing the supporting stage, the pressing device, and the ultraviolet irradiation device. The pressing device includes an ultraviolet transmitting plate. The pressing device drives the ultraviolet transmitting plate to generate a pressing force for pressing the semiconductor wafer with a protective member attached thereto on a supporting stage. The pressing device is moved relatively to the supporting stage such that the semiconductor wafer and the protective member are sandwiched between the ultraviolet transmitting plate and the supporting stage. The ultraviolet rays emitted from the ultraviolet irradiation device pass through the ultraviolet transmitting plate and are irradiated to the protective member.