公开(公告)号：US20170243047A1

公开(公告)日：2017-08-24

申请号：US15434140

申请日：2017-02-16

Applicant: PRIMAX ELECTRONICS LTD.

Inventor： CHING-HUI CHANG ,  TUNG-YING WU

IPC: G06K9/00

CPC classification number: G06K9/00013 ,  G06K9/0002 ,  G06K9/00053 ,  G06K9/00087

Abstract: A fingerprint identification module includes a substrate, a sensing die, a mold compound layer and a circuit board. The substrate includes plural electrical contacts. The plural electrical contacts are exposed outside the substrate. The sensing die is attached on the substrate and electrically connected with the substrate so as to sense a fingerprint image. The mold compound layer is formed on the substrate to encapsulate the sensing die. The circuit board includes plural connection pads. The circuit board and the substrate are electrically connected with each other through the plural connection pads and the plural electrical contacts. The substrate and the circuit board are not integrally formed with each other.

公开(公告)号：US20230051039A1

公开(公告)日：2023-02-16

申请号：US17455995

申请日：2021-11-22

Applicant: PRIMAX ELECTRONICS LTD.

Inventor： SHENG-HSIANG CHIU ,  CHING-HUI CHANG

IPC: H05K3/30 ,  H04N5/225 ,  H05K1/18 ,  H01L27/146 ,  G03B17/02 ,  H05K1/03

Abstract: A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

公开(公告)号：US20230050012A1

公开(公告)日：2023-02-16

申请号：US17482484

申请日：2021-09-23

Applicant: PRIMAX ELECTRONICS LTD.

Inventor： CHING-HUI CHANG ,  YI-HOU CHEN

IPC: G02B7/00 ,  G02B7/182

Abstract: An active alignment machine includes a base, a first pillar, a second pillar, a distribution module, a first alignment module, a second alignment module and a third alignment module. The first pillar has a first pillar top surface. The second pillar has a second pillar top surface. The first pillar top surface and the second pillar top surface cooperatively support plural assembling specifications. The distribution module is installed on the base and arranged between the first pillar and the second pillar. The first alignment module, the second alignment module and third alignment module are replaceable to be assembled with or dissembled from the first pillar top surface and the second pillar top surface. The first alignment module, the second alignment module and third alignment module work with the distribution module to perform the active alignment on a first-type product, a second-type product and a third-type product, respectively.

公开(公告)号：US20250062592A1

公开(公告)日：2025-02-20

申请号：US18454831

申请日：2023-08-24

Applicant: PRIMAX ELECTRONICS LTD.

Inventor： CHING-HUI CHANG ,  SHENG-HSIANG CHIU

IPC: H01S5/0232 ,  H01L23/00 ,  H01S5/0236 ,  H01S5/0237 ,  H01S5/024 ,  H05K1/18 ,  H05K3/34

Abstract: An optical module packaging structure is provided, which includes a circuit board, an electronic component, a lead frame and a light emitting module. The electronic component is disposed on the circuit board. The lead frame is disposed on the electronic component, in which the lead frame has a first connection portion electrically connected to the circuit board. The light emitting module is disposed on the lead frame, in which the light emitting module includes a first connection pad located at a bottom of the light emitting module, and the first connection pad is electrically connected to the circuit board through the first connection portion of the lead frame. A method of manufacturing the aforementioned optical module packaging structure is also provided.