公开(公告)号：US20180030189A1

公开(公告)日：2018-02-01

申请号：US15662372

申请日：2017-07-28

Applicant: PROMERUS, LLC

Inventor： BRIAN KNAPP ,  CHERYL BURNS

IPC: C08F232/08 ,  G03F7/038 ,  H01L21/027 ,  G03F7/20 ,  G03F7/32 ,  G03F7/039 ,  G03F7/004

Abstract: Various vinyl addition polymers of nadic anhydride are disclosed. Examples of such polymers include copolymers and terpolymers of nadic anhydride with a wide variety of norbornene-type monomers. The nadic anhydride polymers are found to be useful in forming a wide variety of photosensitive compositions, both positive and negative, which are capable of forming high resolution imageable films exhibiting excellent dielectric properties (low-k) and thermal properties, and thus are useful in the fabrication of a variety of microelectronic and optoelectronic devices, among others.

公开(公告)号：US20210116807A1

公开(公告)日：2021-04-22

申请号：US16655373

申请日：2019-10-17

Applicant: PROMERUS, LLC

Inventor： BRIAN KNAPP ,  CHERYL BURNS ,  CAROLYN SCHERGER

IPC: G03F7/023 ,  C08K5/13 ,  C08K5/5435 ,  C08K5/18 ,  G03F7/32 ,  G03F7/38 ,  G03F7/40 ,  C08G61/02

Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain multifunctional crosslinking agents, and two or more phenolic compounds which are resistant to thermo-oxidative chain degradation and exhibit improved mechanical properties.

公开(公告)号：US20140322647A1

公开(公告)日：2014-10-30

申请号：US14261922

申请日：2014-04-25

Applicant: PROMERUS, LLC ,  Sumitomo Bakelite Co., Ltd

Inventor： BRIAN KNAPP ,  CHERYL BURNS ,  EDMUND ELCE ,  KEITARO SETO ,  HIROMICHI SUGIYAMA ,  MAKOTO HORII ,  KAZUYOSHI FUJITA

IPC: G03F7/004 ,  G03F7/20

CPC classification number: G03F7/0757 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0751 ,  G03F7/20 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are resistant to thermo-oxidative chain degradation.

Abstract translation: 本发明涉及含有聚降冰片烯（PNB）聚合物和某些可用于形成微电子和/或光电器件及其组件的添加剂的光敏组合物，更具体地涉及包含PNB和某些受阻酚的组合物， 氧化链降解。

公开(公告)号：US20240109994A1

公开(公告)日：2024-04-04

申请号：US18243304

申请日：2023-09-07

Applicant: PROMERUS, LLC

Inventor： PRAMOD KANDANARACHCHI ,  CHERYL BURNS ,  DOUG SKILSKYJ ,  LARRY F. RHODES

IPC: C08F232/08 ,  C08J5/18 ,  C08K5/14 ,  C08K5/315 ,  C08L45/00

CPC classification number: C08F232/08 ,  C08J5/18 ,  C08K5/14 ,  C08K5/315 ,  C08L45/00 ,  C08F2800/10 ,  C08F2810/20 ,  C08J2345/00 ,  C08L2203/16 ,  C08L2205/06 ,  C08L2312/00

Abstract: Embodiments in accordance with the present invention encompass copolymers and terpolymers of a variety of polycycloolefinic monomers at least one of which monomer contains an additional unpolymerized ethylenic bond. In further aspect of this invention there is provided an embodiment encompassing compositions containing the polymers of this invention, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others.

公开(公告)号：US20160319060A1

公开(公告)日：2016-11-03

申请号：US15209289

申请日：2016-07-13

Applicant: PROMERUS, LLC ,  SUMITOMO BAKELITE CO., LTD.

Inventor： CHRISTOPHER APANIUS ,  ANDREW BELL ,  CHERYL BURNS ,  CRYSTAL CYRUS ,  EDMUND ELCE ,  ROYCE GROFF ,  SRIDEVI KAITI ,  BRIAN KNAPP ,  HENDRA NG ,  SEISHI OHASHI ,  WEI ZHANG

IPC: C08F232/08 ,  H01L23/532 ,  G03F7/038 ,  C09J7/02 ,  G03F7/039 ,  H01L21/683 ,  C09J145/00

CPC classification number: C08F232/08 ,  C08F2500/13 ,  C08F2500/25 ,  C08F2500/26 ,  C08F2800/20 ,  C08K5/13 ,  C08K5/18 ,  C09J7/22 ,  C09J7/35 ,  C09J145/00 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2400/143 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/038 ,  G03F7/039 ,  G03F7/0395 ,  H01L21/6836 ,  H01L23/5329 ,  H01L51/004 ,  H01L51/0043

Abstract: The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized where such the PNBs of such compositions and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.

公开(公告)号：US20250122402A1

公开(公告)日：2025-04-17

申请号：US18911843

申请日：2024-10-10

Applicant: PROMERUS, LLC

Inventor： PAUL D. BYRNE ,  CHERYL BURNS ,  CAROLYN SCHERGER

IPC: C09D145/00 ,  C08F32/08 ,  C09D4/00

Abstract: Embodiments in accordance with the present invention encompass compositions comprising a heteroaryl compound ligated palladium compound, a photoacid generator, a photosensitizer and one or more olefinic monomers which undergo vinyl addition polymerization only when said composition is exposed to a suitable actinic radiation to form a substantially transparent film. The composition of this invention exhibit unusual shelf-life stability and are photolytically active even in the presence of air. The monomers employed therein have a range of optical and mechanical properties, and thus these compositions can be tailored to form films, including thin films, having various opto-electronic properties even under atmospheric conditions without the need of inert atmosphere. Accordingly, compositions of this invention are useful in various applications, including as coatings, encapsulants, fillers, leveling agents, among others.

公开(公告)号：US20240110003A1

公开(公告)日：2024-04-04

申请号：US18243390

申请日：2023-09-07

Applicant: PROMERUS, LLC

Inventor： RUSLAN BURTOVYY ,  PRAMOD KANDANARACHCHI ,  CHERYL BURNS ,  CAROLYN SCHERGER

IPC: C08G61/08 ,  C08F236/20 ,  C08K3/38 ,  C08K5/3492 ,  C08K5/5313 ,  C08L65/00 ,  H01Q1/38

CPC classification number: C08G61/08 ,  C08F236/20 ,  C08K3/38 ,  C08K5/3492 ,  C08K5/5313 ,  C08L65/00 ,  H01Q1/38 ,  C08G2261/3324 ,  C08K2003/385 ,  C08K2201/005 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/206

Abstract: Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers optionally at least one of which monomer contains an additional unpolymerized ethylenic bond, organophosphorus compound, optionally hexagonal boron nitride, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire retardancy and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to excellent thermal and dielectric properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention has a UL-94 rating of V-0, dielectric constant (Dk) less than 2.7 and dielectric dissipation factor (Df) of less than 0.0009.

公开(公告)号：US20200283579A1

公开(公告)日：2020-09-10

申请号：US16809556

申请日：2020-03-05

Applicant: PROMERUS, LLC

Inventor： PRAMOD KANDANARACHCHI ,  CHERYL BURNS ,  BRIAN KNAPP ,  LARRY F RHODES

IPC: C08G73/10

Abstract: Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

公开(公告)号：US20160223908A1

公开(公告)日：2016-08-04

申请号：US15097050

申请日：2016-04-12

Applicant: PROMERUS, LLC ,  SUMITOMO BAKELITE CO., LTD

Inventor： BRIAN KNAPP ,  CHERYL BURNS ,  EDMUND ELCE ,  KEITARO SETO ,  HIROMICHI SUGIYAMA ,  MAKOTO HORII ,  KAZUYOSHI FUJITA

IPC: G03F7/075 ,  G03F7/20 ,  G03F7/32 ,  H01L21/311 ,  H01L21/027 ,  H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  G03F7/16 ,  G03F7/40

CPC classification number: G03F7/0751 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/20 ,  H01L21/0274 ,  H01L21/31138 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/85375 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

Abstract translation: 本发明涉及含有聚降冰片烯（PNB）聚合物和某些可用于形成微电子和/或光电器件及其组件的添加剂的光敏组合物，更具体地涉及包含PNB和某些受阻酚作为添加剂的组合物，其可以控制 通过辐射粘附。