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公开(公告)号：US20240026203A1
公开(公告)日：2024-01-25
申请号：US18481810
申请日：2023-10-05
Inventor： Asahi KASUE
Abstract: The present disclosure provides a thermal interface composition that allows a thermal interface material with high thermal conductivity to be formed and that has good moldability. A thermal interface composition according to the present disclosure includes: a resin (A); and a carbon-based material (B) having a surface coated with an inorganic substance.
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公开(公告)号：US20240228855A9
公开(公告)日：2024-07-11
申请号：US18548316
申请日：2022-03-09
Inventor： Keiichi KOMATSU , Asahi KASUE , Atsushi YAMAGUCHI
CPC classification number: C09K5/14 , C08K3/22 , C08L63/00 , C08K2003/2227 , C08K2201/001 , C08L2207/02
Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.
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公开(公告)号：US20240132767A1
公开(公告)日：2024-04-25
申请号：US18548316
申请日：2022-03-09
Inventor： Keiichi KOMATSU , Asahi KASUE , Atsushi YAMAGUCHI
CPC classification number: C09K5/14 , C08K3/22 , C08L63/00 , C08K2003/2227 , C08K2201/001 , C08L2207/02
Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.
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