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公开(公告)号:US11658457B2
公开(公告)日:2023-05-23
申请号:US16780856
申请日:2020-02-03
Inventor: Takahiro Miyake , Yasuhisa Inada , Tosihiko Wada
CPC classification number: H01S5/022 , G02B5/18 , G02B6/02209 , G02B6/34 , G02B6/42 , G02B6/4204 , G02B6/4214 , H01S5/023
Abstract: A mounting structure for an optical module includes a light emitting element, a submount board on which the light emitting element is mounted, a main board on which the submount board is mounted, a light guide member provided on the main board, and a diffraction grating optical coupler provided on the main board and connected to the light guide member. The submount board and the main board are bonded to each other on a surface of the submount board different from a surface on which the light emitting element is mounted.