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公开(公告)号：US20210364282A1
公开(公告)日：2021-11-25
申请号：US17395867
申请日：2021-08-06
Inventor： Yousuke IRIE , Hirotsugu INOUE , Koutaro SAKAMOTO
Abstract: A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.
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公开(公告)号：US20190353538A1
公开(公告)日：2019-11-21
申请号：US16527582
申请日：2019-07-31
Inventor： Yousuke IRIE , Hirotsugu INOUE , Takuya NIIOKA
Abstract: In a stress measurement method, an object to be measured is vibrated at a plurality of oscillation frequencies, and a temperature amplitude of the object to be measured is measured by using a temperature sensor. Parameters of a one-dimensional heat conduction equation described below are identified by performing curve-fitting, on the basis of the one-dimensional heat conduction equation, on a measurement value of the temperature amplitude with respect to frequency characteristics of a temperature change component and a phase component based on a thermoelastic effect. The frequency characteristics are obtained at the plurality of oscillation frequencies. The one-dimensional heat conduction equation indicates a theoretical solution of a temperature amplitude on a surface of a coating film based on heat conduction and the thermoelastic effect of each of a substrate and the coating film. Then, a stress of the object to be measured is obtained based on the identified parameters.
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公开(公告)号：US20190310174A1
公开(公告)日：2019-10-10
申请号：US16449777
申请日：2019-06-24
Inventor： Yousuke IRIE , Hirotsugu INOUE , Ryougo KAWAI
Abstract: A fatigue limit stress specification system includes: a vibration generator that repeatedly applies a load to an object to be measured; a temperature sensor that measures a change in temperature of the object to be measured; and an information processing device that measures a fatigue limit stress of the object to be measured. The information processing device obtains a relation between a temperature amplitude of a fundamental frequency component of vibration for the object to be measured and a temperature amplitude of a second harmonic component of the vibration, performs fitting on the relation by using a first approximate line and a second approximate line, the first approximate line including a quadratic curve, the second approximate line including a quadratic curve, and obtains the fatigue limit stress of the object to be measured based on an intersection of the first approximate line and the second approximate line.
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4.发明公开公开(公告)号：US20240219175A1
公开(公告)日：2024-07-04
申请号：US18601648
申请日：2024-03-11
Inventor： Yousuke IRIE , Hirotsugu INOUE , Koutaro SAKAMOTO
CPC classification number: G01B21/085 , G01J5/0003 , G01N25/72 , G01J2005/0077 , G01K3/04 , G01K3/06
Abstract: A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.
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公开(公告)号：US20220180502A1
公开(公告)日：2022-06-09
申请号：US17679298
申请日：2022-02-24
Inventor： Yousuke IRIE , Hirotsugu INOUE , Michiyasu HIROTA
Abstract: A stress analysis device includes: an imaging element that obtains temperature images over a same time range for a same region of an object; a feature point extractor that extracts a feature point in each of the temperature images; a projection transformer that performs projective transformation on each of the temperature images to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image being a reference; a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference; a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.
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Patent Agency Ranking
公开(公告)号：US20210404894A1
公开(公告)日：2021-12-30
申请号：US17467836
申请日：2021-09-07
Inventor： Yousuke IRIE
Abstract: A stress properties measurement method for measuring properties of stresses generated in a structure includes acquiring, from a first imaging device, a plurality of thermal images corresponding to temperatures of a surface of the structure, the plurality of thermal images being different in imaging time from each other, generating a stress distribution image corresponding to each of the plurality of thermal images, acquiring a stress value of a first section that is smaller in stress gradient than a predetermined value and respective stress values of a plurality of second sections where stresses are concentrated for the stress distribution images, and deriving correlation properties of stresses at a section of the structure based on the stress value of the first section acquired and the respective stress values of the plurality of second sections acquired.
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公开(公告)号：US20210102846A1
公开(公告)日：2021-04-08
申请号：US17124735
申请日：2020-12-17
Inventor： Yousuke IRIE , Ryoji HIROSE
IPC: G01K5/56 , G01M5/00 , G01L1/24 , G01M99/00 , G01M11/08 , G01N25/72 , G06T7/00 , G06T7/20 , H04N5/33
Abstract: A stress distribution measurement method is a method of measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first image data by performing, through a first image capturing unit, image capturing of a moving object or an identification display object attached to the structural object from the moving object; calculating, based on the first image data, a movement duration in which the moving object moves between the support parts; generating, as second image data, thermal image data by performing image capturing of the surface of the beam part through a second image capturing unit; calculating a temperature change amount based on a second image data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.
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公开(公告)号：US20210048356A1
公开(公告)日：2021-02-18
申请号：US17085403
申请日：2020-10-30
Inventor： Yousuke IRIE
IPC: G01L1/24 , G01K3/10 , G01J5/00 , H04N5/33 , H04N7/18 , G01B11/16 , G01L1/00 , G01M5/00 , G01N25/20 , G01N25/72 , G01M99/00 , G01M11/08
Abstract: A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.
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9.发明申请公开(公告)号：US20180372487A1
公开(公告)日：2018-12-27
申请号：US16047373
申请日：2018-07-27
Inventor： Yousuke IRIE , Hirotsugu INOUE , Shogo TOKUNAGA , Yu KUROKAWA , Takuya NIIOKA
Abstract: Method for measuring a depth of a defect inside an inspection object is provided. The method comprises steps of: generating thermal image data corresponding to a temperature of a surface of the inspection object by photographing a heated surface of the inspection object at a predetermined time interval by a photographing device; obtaining a temperature curve showing a temporal change in temperature of the surface of the inspection object based on the thermal image data; fitting a theoretical equation obtained from a heat conduction equation including a parameter related to the depth of the defect of the inspection object to the temperature curve to obtain a theoretical curve showing a temporal change in temperature of the surface of the inspection object; and obtaining the depth of the defect of the inspection object based on a value of the parameter in the theoretical equation corresponding to the theoretical curve.
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公开(公告)号：US20220187162A1
公开(公告)日：2022-06-16
申请号：US17563627
申请日：2021-12-28
Inventor： Yousuke IRIE
Abstract: A stress distribution image processing device including: a processing unit configured to: designate a normalization region which includes a portion of stress equal to or larger than a predetermined threshold value in a screen of a stress distribution image of a target object; and normalize pixels in the normalization region based on stress values in the normalization region to obtain a normalized image.
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