公开(公告)号：US20190118388A1

公开(公告)日：2019-04-25

申请号：US16174583

申请日：2018-10-30

Applicant: Perception Robotics, Inc.

Inventor： Mohammad DADKHAH TEHRANI ,  Nicholas WETTELS

IPC: B25J15/00 ,  C09J11/04 ,  C09J9/02 ,  B81C1/00 ,  C09J201/00 ,  C09J7/00

CPC classification number: B25J15/0085 ,  B81B2207/056 ,  B81C1/00 ,  B81C1/00206 ,  C08K3/04 ,  C08K3/041 ,  C08K2201/001 ,  C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  C09J2201/626

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.