公开(公告)号：US07492325B1

公开(公告)日：2009-02-17

申请号：US11242806

申请日：2005-10-03

Applicant: Peter J. Moosbrugger ,  Tim Meenach

Inventor： Peter J. Moosbrugger ,  Tim Meenach

IPC: H01Q21/00 ,  H01Q3/26

CPC classification number: H01Q21/0093 ,  H01Q21/0087 ,  H05K1/144 ,  H05K2201/09227

Abstract: A modular electronic architecture according to which electrical components are distributed across substantially identical, interconnected circuit elements or assemblies is provided. Scaling of the electronic device can be achieved by selecting different numbers of circuit elements. Embodiments of the present invention may also provide for a compact assembly, formed from interconnection of separate circuit boards in a stack. Particular applications include the provision of beam forming networks in connection with phased array antennas in which the beam forming networks are formed on circuit boards having an area that is about the same size as the area of a circuit board on which the antenna elements are formed.

Abstract translation: 提供了一种模块化电子架构，其中电气部件分布在基本相同的互连电路元件或组件上。 可以通过选择不同数量的电路元件来实现电子设备的缩放。 本发明的实施例还可以提供由堆叠中的单独电路板的互连形成的紧凑组件。 具体应用包括提供与相控阵天线相连的波束形成网络，其中波束形成网络形成在具有与其上形成天线元件的电路板的面积大致相同的大小的电路板上。