公开(公告)号：US09746247B2

公开(公告)日：2017-08-29

申请号：US14610554

申请日：2015-01-30

Applicant: Phononic Devices, Inc.

Inventor： Jesse W. Edwards ,  Robert B. Allen ,  Daniel Swann

IPC: F28D15/00 ,  F28D15/02 ,  F28F13/00 ,  F28D15/04

CPC classification number: F28D15/0266 ,  F28D15/0275 ,  F28D15/046 ,  F28F13/003

Abstract: The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.

公开(公告)号：US20160018141A1

公开(公告)日：2016-01-21

申请号：US14849232

申请日：2015-09-09

Applicant: Phononic Devices, Inc.

Inventor： Jesse W. Edwards ,  Robert Joseph Therrien ,  Daniel Barus ,  Marshall Stanley ,  Abhishek Yadav ,  Daniel Swann

IPC: F25B21/04 ,  H01L35/02

CPC classification number: F25B21/04 ,  F25B2321/0212 ,  H01L35/02

Abstract: Systems and methods for mitigating heat rejection limitations of a thermoelectric module are disclosed. In some embodiments, a method of operating a thermoelectric module includes providing a first amount of power to the thermoelectric module and determining that a temperature of a hot side of the thermoelectric module is above a first threshold. The method also includes, in response to determining that the temperature of the hot side is above the first threshold, providing a second amount of power to the thermoelectric module that is less than the first amount of power. The method also includes determining that the temperature of the hot side of the thermoelectric module is below a second threshold and providing a third amount of power to the thermoelectric module. In some embodiments, this mitigates heat rejection limitations of the thermoelectric module, especially when the hot side of the thermoelectric module is passively cooled.

Abstract translation: 公开了一种用于减轻热电模块的排热限制的系统和方法。 在一些实施例中，操作热电模块的方法包括向热电模块提供第一量的功率并且确定热电模块的热侧的温度高于第一阈值。 该方法还包括响应于确定热侧的温度高于第一阈值，向热电模块提供小于第一功率量的第二量的功率。 该方法还包括确定热电模块的热侧的温度低于第二阈值并且向热电模块提供第三量的功率。 在一些实施例中，这减轻了热电模块的排热限制，特别是当热电模块的热侧被动冷却时。

公开(公告)号：US20150211803A1

公开(公告)日：2015-07-30

申请号：US14610554

申请日：2015-01-30

Applicant: Phononic Devices, Inc.

Inventor： Jesse W. Edwards ,  Robert B. Allen ,  Daniel Swann

IPC: F28D15/02

CPC classification number: F28D15/0266 ,  F28D15/0275 ,  F28D15/046 ,  F28F13/003

Abstract: The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.

Abstract translation: 本公开涉及用热传导基体材料增加热虹吸系统的系统，装置和方法，以增加在热虹吸系统的预定区域处的热传导的表面积与体积比，同时最小化毛细管力 被隔离到那些地区。 热虹吸系统具有包括冷凝器区域，蒸发器区域和绝热区域（例如，冷凝器和蒸发器区域之间的区域）的管道。 管道可以包含传热介质，并且可以根据热虹吸原理在冷凝器和蒸发器区域之间提供热传输介质的无源两相输送。 该系统还包括包含在冷凝器区域和/或蒸发器区域中但不在绝热区域中的导热基质材料，使得导热基质材料增加了在冷凝器区域和/或蒸发器中传热的表面积 地区。