公开(公告)号：US20240405042A1

公开(公告)日：2024-12-05

申请号：US18204959

申请日：2023-06-02

Applicant: PixArt Imaging Inc.

Inventor： Jen-Chuan Chen ,  Chi-Chih Shen ,  Hsuan-Yao Chang ,  Yu-Chiao Peng

IPC: H01L27/146 ,  H01L31/18

Abstract: An optical detection module and a related manufacturing method are applied for chip scale package technology. The optical detection module includes a chip scale package assembly and a light sheltering layer. The chip scale package assembly includes a glass substrate, a detection chip, an isolation layer, a plurality of redistribution layers, and a plurality of conductive contacts. The detection chip is located above the glass substrate. The isolation layer is disposed on a surface of the detection chip opposite to the glass substrate. The plurality of redistribution layers is disposed on the isolation layer and spaced from each other, and having a plurality of conductive units. The plurality of conductive contacts is respectively disposed on the plurality of conductive units. The light sheltering layer is disposed on a lateral surface of the chip scale package assembly, and adapted to block light transmission and provide a covering protection function.