公开(公告)号：US09316768B2

公开(公告)日：2016-04-19

申请号：US14546298

申请日：2014-11-18

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Ki Myung Nam ,  Kyung Soo Yoo

IPC: G02B5/08 ,  B32B3/26

CPC classification number: G02B5/085 ,  B32B3/26 ,  B32B3/263 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2551/00 ,  Y10T428/24612

Abstract: A substrate for an optical device includes an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces. A groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove.

Abstract translation: 用于光学器件的衬底包括：光学器件衬底，其包括沿着长度方向伸长的多个导电板，其中导电板的侧表面彼此接合，绝缘体彼此接合，绝缘体分别形成在侧表面上。 在光学元件基板沿长度方向和垂直方向切割时，在光学元件基板的下表面上形成有用于防止毛刺的预定深度的凹槽，其中切割线与绝缘体之一交叉的每个点处 所述槽形成为使得所述绝缘体中的一个暴露于所述槽的内部。

公开(公告)号：US20150138659A1

公开(公告)日：2015-05-21

申请号：US14546298

申请日：2014-11-18

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Ki Myung Nam ,  Kyung Soo Yoo

IPC: G02B5/08 ,  B32B3/26

CPC classification number: G02B5/085 ,  B32B3/26 ,  B32B3/263 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2551/00 ,  Y10T428/24612

Abstract: A substrate for an optical device includes an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces. A groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove.

Abstract translation: 用于光学器件的衬底包括：光学器件衬底，其包括沿着长度方向伸长的多个导电板，其中导电板的侧表面彼此接合，绝缘体彼此接合，绝缘体分别形成在侧表面上。 在光学元件基板沿长度方向和垂直方向切割时，在光学元件基板的下表面上形成有用于防止毛刺的预定深度的凹槽，其中切割线与绝缘体之一交叉的每个点处 所述槽形成为使得所述绝缘体中的一个暴露于所述槽的内部。