公开(公告)号：US12083620B2

公开(公告)日：2024-09-10

申请号：US16226750

申请日：2018-12-20

Applicant: PowerPhotonic Ltd.

Inventor： Paul Blair ,  Chris Courtney ,  Tina Parsonage ,  Amiel Lopes ,  Krystian L. Wlodarczyk ,  Duncan P. Hand

IPC: B23K26/0622 ,  B23K26/00 ,  B23K26/08 ,  B23K26/082 ,  B23K26/352 ,  B23K26/36 ,  B23K26/40 ,  B23K103/00 ,  B29D11/00 ,  C03C23/00 ,  G02B27/09 ,  H01S5/40

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/352 ,  B23K26/355 ,  B23K26/3576 ,  B23K26/36 ,  B23K26/40 ,  B29D11/00 ,  B29D11/00298 ,  C03C23/0025 ,  G02B27/0961 ,  H01S5/4043 ,  B23K2103/54 ,  B29D11/00932

Abstract: A direct write laser based machining process wherein a laser beam is controlled to machine a glass material in an interlaced raster scan pattern. An embodiment of machining a glass substrate to form an optical element is described. An ultrashort pulsed laser is used for machining and smoothing fused silica, followed by CO2 laser polishing. High speed and high quality machining is possible using this approach, which allows efficient use of high laser repetition rates.

公开(公告)号：US20190193198A1

公开(公告)日：2019-06-27

申请号：US16226750

申请日：2018-12-20

Applicant: PowerPhotonic Ltd.

Inventor： Paul Blair ,  Chris Courtney ,  Tina Parsonage ,  Amiel Lopes ,  Krystian L. Wlodarczyk ,  Duncan P. Hand

IPC: B23K26/0622 ,  B29D11/00 ,  G02B27/09 ,  H01S5/00 ,  H01S5/40 ,  C03C23/00 ,  B23K26/352

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/352 ,  B23K26/355 ,  B23K26/3576 ,  B23K26/36 ,  B23K26/40 ,  B23K2103/54 ,  B29D11/00 ,  B29D11/00298 ,  B29D11/00932 ,  C03C23/0025 ,  G02B27/0961 ,  H01S5/005 ,  H01S5/4043

Abstract: A direct write laser based machining process wherein a laser beam is controlled to machine a glass material in an interlaced raster scan pattern. An embodiment of machining a glass substrate to form an optical element is described. An ultrashort pulsed laser is used for machining and smoothing fused silica, followed by CO2 laser polishing. High speed and high quality machining is possible using this approach, which allows efficient use of high laser repetition rates.