公开(公告)号：US09627228B1

公开(公告)日：2017-04-18

申请号：US15226930

申请日：2016-08-03

Applicant: Powertech Technology Inc.

Inventor： Shih-Chun Chen ,  Sheng-I Huang ,  Ying-Lin Chen ,  Ta-Hao Chang ,  I-Fong Wu ,  Chi-Chung Yu

IPC: H01L21/56 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/78

CPC classification number: H01L21/78 ,  H01L21/4871 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/014

Abstract: A method for manufacturing a chip package structure having a coating layer is provided. At least one chip package structure is mounted onto a terminal-protection film. The chip package structure has a top side, a back side opposite to the top side and a plurality of lateral sides. A plurality of terminals is disposed on the back side. The terminal-protection film at least partially seals the back side. A coating layer is formed over the top side, the lateral sides and a periphery region of the chip package structure, wherein the coating layer is not formed on the back side and the terminals. The terminal-protection film is debonded from the chip package structure.

公开(公告)号：US20210365651A1

公开(公告)日：2021-11-25

申请号：US17037949

申请日：2020-09-30

Applicant: POWERTECH TECHNOLOGY INC.

Inventor： Chi-Chung Yu ,  Kai-Hung LIN ,  Tien-Hung LOU

IPC: G06K7/14 ,  G06K19/06

Abstract: An identification method of an integrated circuit chip of the present invention includes identifying a surface structure or an internal structure of an integrated circuit chip, generating a structural information set according to the surface structure or internal structure, converting the structural information set into an identification information set. The identification information set generated by the above-mentioned identification method can be stored in a digital file, and a chip manufacturer requires no visible information printed on an outer surface of the integrated circuit chip such that factory information of the integrated circuit chip can be concealed. When retrieving the malfunctioned or defective integrated circuit chip, the manufacturer can acquire a new generated identification information set by identify the integrated circuit chip and compare the new generated identification information set and the generated identification information set stored in the file to obtain the factory information of the retrieved integrated circuit chip.