公开(公告)号：US20230411419A1

公开(公告)日：2023-12-21

申请号：US18327449

申请日：2023-06-01

Applicant: Powertech Technology Inc.

Inventor： Ching-Chao LIN

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L27/14632

Abstract: A fan-out package structure of an image sensing device includes an image sensing unit having an image sensor with opposite sensing surface and connecting surface, a spacer layer surrounding a central portion of the sensing surface, and a light-transmitting cover plate disposed on the spacer layer spaced apart from and covering the sensing surface. An image signal processor is disposed on the connecting surface. A redistribution layer covers the image signal processor and the connecting surface, and includes a fan-out area. An encapsulation layer is disposed on the fan-out area, surrounds and covers an outer periphery of the image sensing unit, and allows a top surface of the light-transmitting cover plate to be exposed. A method of manufacturing a fan-out package structure of an image sensing device is also disclosed.