公开(公告)号：US20210217632A1

公开(公告)日：2021-07-15

申请号：US17094537

申请日：2020-11-10

Applicant: Powertech Technology Inc.

Inventor： Shih-Chun CHEN ,  Sheng-Tou TSENG ,  Kun-Chi HSU ,  Chin-Ta WU ,  Ting-Yeh WU

IPC: H01L21/56 ,  H01L23/552

Abstract: Batch semiconductor packaging structures with back-deposited shielding layer and manufacturing method are provided. A grid having multiple frames is glued on an adhesive substrate. Multiple semiconductor devices respectively align with corresponding frames and are stuck on the adhesive substrate. Then a metal layer covers the semiconductor devices and the grid. A distance between four peripheries of a bottom of each semiconductor device and the corresponding frame is smaller than a distance between the bottom and the adhesive substrate, so that the a portion of the metal layer extended to the peripheries of the bottom is effectively reduced during forming the metal layer. After the semiconductor devices are picked up, no metal scrap is remined thereon. Therefore, the adhesive substrate does not need to form openings in advance and is reusable. The grid is also reusable so the manufacturing cost of the present invention is decreased.

公开(公告)号：US20220118631A1

公开(公告)日：2022-04-21

申请号：US17183752

申请日：2021-02-24

Applicant: Powertech Technology Inc.

Inventor： Wu-Yi CHOU ,  Kun-Chi HSU ,  Chin-Ta WU ,  Yung-Chin SHIH ,  Chin Cheng LIU ,  Jentung TSENG

IPC: B25J15/06 ,  H01L21/683

Abstract: A head of chip picker is disclosed. The head has a clipping seat and an elastic block. The clipping seat has a body and two arms. The arms are respectively and downwardly extended from two opposite sides of an inner top surface of the body, so a cavity with a wide-top and narrow-bottom shape is constituted among the inner top surface and the arms. The elastic block matches the cavity and is laterally inserted into the cavity. The elastic block is not deformed after inserting into the cavity and provides a flat bottom surface.

公开(公告)号：US20210288003A1

公开(公告)日：2021-09-16

申请号：US17094101

申请日：2020-11-10

Applicant: Powertech Technology Inc.

Inventor： Shih-Chun CHEN ,  Sheng-Tou TSENG ,  Kun-Chi HSU ,  Chin-Ta WU ,  Ying-Lin CHEN ,  Ting-Yeh WU

IPC: H01L23/66 ,  H01L25/065 ,  H01L23/31 ,  H01Q1/22 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package having a partial outer metal layer and packaging method thereof is disclosed. In the method, a specific packaging substrate or a specific positioning plate is used to package multiple semiconductor devices and a partial outer metal layer is quickly formed on an encapsulation of each semiconductor device in the same step.

公开(公告)号：US20210339338A1

公开(公告)日：2021-11-04

申请号：US16997223

申请日：2020-08-19

Applicant: Powertech Technology Inc.

Inventor： Chui-Liang CHIU ,  Kun-Chi HSU ,  Chin-Ta WU ,  Ching-Lin TSENG ,  Chia-Wei LIN ,  Jentung Tseng

IPC: B23K26/042 ,  H01L21/784 ,  B23K26/364

Abstract: A laser cutting method for a wafer is provided. First, an active side of a wafer is cut by a laser to form multiple cutting grooves so that the thicker and harder layer of the integrated circuit on the active side is cut. Then the stealth laser is used to cut the backside of the wafer by aligning the beams of the stealth laser with the cutting grooves. Therefore, the cutting grooves easily extend to the backside of the wafer and penetrate through the wafer to dice the wafer into multiple independent chips.

公开(公告)号：US20210217641A1

公开(公告)日：2021-07-15

申请号：US16998266

申请日：2020-08-20

Applicant: Powertech Technology Inc.

Inventor： Shih-Chun CHEN ,  Sheng-Tou TSENG ,  Kun-Chi HSU ,  Chin-Ta WU ,  Ying-Lin CHEN ,  Ting-Yeh WU

IPC: H01L21/673 ,  C23C14/56

Abstract: A chip carrier device includes a frame, a chip support and a limiter. The chip support is disposed on the frame, and includes a supporting film for chips to be adhered thereto. A peripheral portion of the supporting film is attached to a surrounding frame part of the frame. A crossing portion of the supporting film passes through a center of the supporting film, and interconnects two opposite points of the peripheral portion. The supporting film is formed with through holes. The limiter includes a limiting part that interconnects two opposite points of the surrounding frame part, that is positioned corresponding to the crossing portion, and that is positioned on one side of the supporting film where the chips are to be arranged.