公开(公告)号：US20210272907A1

公开(公告)日：2021-09-02

申请号：US16879028

申请日：2020-05-20

Applicant: Powertech Technology Inc.

Inventor： Ming-Yi WANG ,  Yu-Ping WANG

IPC: H01L23/538 ,  H01L21/48

Abstract: A redistribution layer of fan-out package and manufacturing method thereof is disclosed. Before forming a pattern wiring layer on each dielectric insulation layer, a thin metal ion layer is formed firstly. A connection between the metal ion layer and the corresponding dielectric insulation layer is weaker than that between the patterned wiring layer and the corresponding dielectric insulation layer. When the redistribution layer is placed in a high temperature and high humidity environment, the stress generated by the patterned circuit layer causes that multiple gaps to form between the metal ion layers and the corresponding dielectric insulating layer. Therefore, a distance between the adjacent dielectric insulating layer and the patterned wiring layer is increased to reduce the capacitive effect and the power consumption of the thinner redistribution layer.