公开(公告)号：US20170358557A1

公开(公告)日：2017-12-14

申请号：US15434071

申请日：2017-02-16

Applicant: Powertech Technology Inc.

Inventor： Yu-Wei Chen ,  Chi-An Wang ,  Hung-Hsin Hsu

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/04 ,  H01L25/00

CPC classification number: H01L23/3114 ,  H01L23/04 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/15331 ,  H01L2924/1811 ,  H01L2924/18161 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A POP structure includes a first package structure, an interposer, and a second package structure. The first package structure includes a first carrier, a first chip, conductive structures, and a first insulation encapsulation. The first carrier has a first surface and a second surface opposite to the first surface. The first chip and the conductive structures are disposed on the first surface of the first carrier. The first insulation encapsulation is formed on the first surface of the first carrier and encapsulates the conductive structures and the first chip. Top surfaces of the conductive structures are exposed through the first insulation encapsulation and are coplanar. The interposer is disposed on and electrically connected to the first package structure. The second package structure is disposed on and electrically connected to the interposer. A manufacturing method of a POP structure is also provided.

公开(公告)号：US20190252325A1

公开(公告)日：2019-08-15

申请号：US16035709

申请日：2018-07-16

Applicant: Powertech Technology Inc.

Inventor： Yu-Wei Chen ,  Hsuan-Chih Chang ,  Yuan-Fu Lan ,  Hsien-Wen Hsu

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68372 ,  H01L2224/214 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: A chip package structure including a first circuit structure, a chip, an electronic device, a first encapsulant, a second encapsulant, a plurality of through pillars, and an electromagnetic interference (EMI) shielding layer is provided. The chip has an active surface facing the first circuit structure. The electronic device has a connection surface facing the first circuit structure. The chip and the electronic device are disposed on opposite sides of the first circuit structure respectively. The first encapsulant encapsulates the chip. The second encapsulant encapsulates the electronic device. The through pillars penetrate the first encapsulant and are electrically connected to the first circuit structure. The EMI shielding layer covers the first encapsulant and the second encapsulant. The chip or the electronic device is grounded by the EMI shielding layer.