公开(公告)号：US20130224551A1

公开(公告)日：2013-08-29

申请号：US13408206

申请日：2012-02-29

Applicant: Pritesh HIRALAL ,  Samiul Haque ,  Darryl Cotton ,  Chris Bower

Inventor： Pritesh HIRALAL ,  Samiul Haque ,  Darryl Cotton ,  Chris Bower

IPC: H01M10/02 ,  H01G9/10 ,  H01M10/04 ,  B82Y99/00

CPC classification number: H01G9/10 ,  B82Y30/00 ,  B82Y40/00 ,  H01G11/80 ,  H01M2/0207 ,  H01M2/026 ,  H01M2/0275 ,  H01M2/0277 ,  H01M2/028 ,  H01M2/162 ,  H01M2/1626 ,  H01M4/0404 ,  H01M4/0426 ,  H01M4/0428 ,  H01M4/133 ,  H01M4/1393 ,  H01M4/587 ,  H01M4/66 ,  H01M4/661 ,  H01M4/663 ,  H01M4/668 ,  H01M6/06 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0585 ,  H01M12/005 ,  H01M2220/30 ,  H05K1/0283 ,  H05K2201/10037 ,  Y02E60/13 ,  Y10T29/4911

Abstract: An apparatus including at least one substrate, the at least one substrate including first and second electrodes and configured to form a sealed chamber with the first and second electrodes contained therein and facing one another, the sealed chamber including electrolyte in the space between the first and second electrodes, wherein the at least one substrate is configured to undergo reversible stretching whilst still forming the sealed chamber containing the electrolyte.

Abstract translation: 一种包括至少一个基板的装置，所述至少一个基板包括第一和第二电极，并且构造成形成密封室，其中第一和第二电极被容纳在其中并且彼此面对，所述密封室包括在第一和第二电极之间的空间中的电解质 第二电极，其中所述至少一个衬底被配置为进行可逆拉伸同时仍形成包含电解质的密封室。

公开(公告)号：US20130107486A1

公开(公告)日：2013-05-02

申请号：US13590793

申请日：2012-08-21

Applicant: Pritesh HIRALAL

Inventor： Pritesh HIRALAL

IPC: H05K7/06 ,  H05K3/36

CPC classification number: H01G11/84 ,  H01G11/08 ,  H01G11/14 ,  H01M10/04 ,  H05K1/145 ,  H05K1/162 ,  H05K3/0097 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/09909 ,  H05K2201/10037 ,  H05K2203/1147 ,  Y02E60/13 ,  Y10T29/49126

Abstract: An apparatus comprising: first and second circuit boards with respective electrodes thereon, the first and second circuit boards in a bonded configuration; One or more first layers positioned to be proximal to the one or more of the electrodes; electrolyte proximal to the respective electrodes; one or more second layers configured to provide for the bonded configuration in which the first and second circuit boards are bonded together, under curing, such that the respective one or more first layers are positioned between the one or more second layers and the electrodes, the bonding defining a chamber therebetween with the electrodes therein and facing one another, the chamber comprising the electrolyte; and wherein the one or more first layers are configured to inhibit interaction of the electrolyte with the one or more second layers during curing.

Abstract translation: 一种装置，包括：第一和第二电路板，其上具有各自的电极，所述第一和第二电路板处于接合构型; 定位成邻近所述一个或多个电极的一个或多个第一层; 靠近各个电极的电解质; 一个或多个第二层，被配置为提供其中第一和第二电路板结合在一起的接合构造，在固化下，使得相应的一个或多个第一层位于一个或多个第二层和电极之间， 接合，其间具有电极并且彼此面对的室，所述室包括电解质; 并且其中所述一个或多个第一层被配置为在固化期间抑制所述电解质与所述一个或多个第二层的相互作用。