Time-bin qubit converter
    1.
    发明授权

    公开(公告)号:US12019354B2

    公开(公告)日:2024-06-25

    申请号:US18317025

    申请日:2023-05-12

    CPC classification number: G02F3/00 G06N10/40

    Abstract: A system includes a first photonic integrated circuit. The circuit includes a qubit encoder configured to receive a spatial-mode qubit and convert the spatial-mode qubit to a temporal-mode qubit and an optical interconnect configured to receive and transmit the temporal-mode qubit. The system further includes a second photonic integrated circuit, itself including a qubit decoder configured to receive the temporal-mode qubit and convert the temporal-mode qubit back into the spatial-mode qubit.

    TIME-BIN QUBIT CONVERTER
    2.
    发明申请

    公开(公告)号:US20250036006A1

    公开(公告)日:2025-01-30

    申请号:US18662156

    申请日:2024-05-13

    Abstract: A system includes a first photonic integrated circuit. The circuit includes a qubit encoder configured to receive a spatial-mode qubit and convert the spatial-mode qubit to a temporal-mode qubit and an optical interconnect configured to receive and transmit the temporal-mode qubit. The system further includes a second photonic integrated circuit, itself including a qubit decoder configured to receive the temporal-mode qubit and convert the temporal-mode qubit back into the spatial-mode qubit.

    TIME-BIN QUBIT CONVERTER
    3.
    发明公开

    公开(公告)号:US20230393447A1

    公开(公告)日:2023-12-07

    申请号:US18317025

    申请日:2023-05-12

    CPC classification number: G02F3/00 G06N10/40

    Abstract: A system includes a first photonic integrated circuit. The circuit includes a qubit encoder configured to receive a spatial-mode qubit and convert the spatial-mode qubit to a temporal-mode qubit and an optical interconnect configured to receive and transmit the temporal-mode qubit. The system further includes a second photonic integrated circuit, itself including a qubit decoder configured to receive the temporal-mode qubit and convert the temporal-mode qubit back into the spatial-mode qubit.

    Multi-chip photonic quantum computer assembly with optical backplane interposer

    公开(公告)号:US11536897B1

    公开(公告)日:2022-12-27

    申请号:US17248652

    申请日:2021-02-01

    Abstract: A system includes a plurality of wafer-scale modules and a plurality of optical fibers. Each wafer-scale module includes an optical backplane and one or more die stacks on the optical backplane. The optical backplane includes a substrate and at least one optical waveguide layer configured to transport and/or manipulate photonic quantum systems (e.g., photons, qubits, qudits, large entangled states, etc.). Each die stack of the one or more die stacks includes a photonic integrated circuit (PIC) die optically coupled to the at least one optical waveguide layer of the optical backplane. The plurality of optical fibers is coupled to the optical backplanes of the plurality of wafer-scale modules to provide inter-module and/or intra-module interconnects for the photonic quantum systems.

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