公开(公告)号：US11817378B2

公开(公告)日：2023-11-14

申请号：US17364220

申请日：2021-06-30

Applicant: QUALCOMM INCORPORATED

Inventor： Nelly Chen ,  Gary Yao Zhang ,  Michael Randy May ,  Shrinivas Gopalan Uppili ,  Varin Sriboonlue

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/66 ,  H05K3/34

CPC classification number: H01L23/49816 ,  H01L23/66 ,  H05K1/0228 ,  H05K3/3436 ,  H01L2223/6605 ,  H05K2201/09227 ,  H05K2201/10098 ,  H05K2201/10734

Abstract: A pin map covers a surface area of a layer of a printed circuit board (PCB). The pin map includes a plurality of electrical designations for each pin in the pin map and a plurality of empty spaces within the pin map. Each electrical designation may be assigned to a pin on the pin map. Each electrical designation includes a positive polarity (P+) pin, a negative polarity (P−) pin, or an electrical ground (G) pin. If a space in the pin map does not have an electrical designation, then it may include an empty space/plain portion of the printed circuit board (PCB). The pin map may include a plurality of rows and a first repeating pin polarity pattern. The first repeating pin polarity pattern may include a lane unit tile. The pin map may help couple two circuit elements together that are attached to one layer of a PCB.