公开(公告)号：US20250164713A1

公开(公告)日：2025-05-22

申请号：US18514225

申请日：2023-11-20

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie YUN ,  Youngju PARK ,  Doosoub SHIN

IPC: G02B6/42 ,  H01Q1/22

Abstract: A device includes a glass layer and an optical fiber directly attached to the glass layer. The device also includes a photo diode electrically connected to an antenna element. The device further includes a lens coupled to or included within the glass layer and configured to manipulate light exchanged between the optical fiber and the photo diode. The photo diode is configured to convert optical signals from the optical fiber into electrical signals for the antenna element, convert electrical signals from the antenna element to optical signals provided to the optical fiber, or both.

公开(公告)号：US20240321724A1

公开(公告)日：2024-09-26

申请号：US18188965

申请日：2023-03-23

Applicant: QUALCOMM Incorporated

Inventor： Doosoub SHIN ,  Changhan Hobie YUN ,  Youngju PARK

IPC: H01L23/522 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/5223 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5227 ,  H01L2223/6616 ,  H01L2223/6661

Abstract: A device includes a passive substrate having a first metallization layer on a first surface of the passive substrate. The first metallization layer is composed of a first passive component and a first plate portion. The device includes an insulator layer coupled to the first plate portion of the first metallization layer. The device also includes a first conductive interconnect coupled to the insulator layer to form a second passive component coupled to the first passive component. The device further includes a laminate substrate coupled to the first conductive interconnect.

公开(公告)号：US20240297165A1

公开(公告)日：2024-09-05

申请号：US18177404

申请日：2023-03-02

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie YUN ,  Paragkumar Ajaybhai THADESAR ,  Sameer Sunil VADHAVKAR ,  Youngju PARK ,  Doosoub SHIN

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L27/01

CPC classification number: H01L25/18 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/50 ,  H01L27/01 ,  H01L23/49811 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/92125

Abstract: A device is described, including a redistribution layer (RDL) substrate. The device also includes a passive component in the RDL substrate proximate a first surface of the RDL substrate. The device further includes a first die coupled to a second surface of the RDL substrate, opposite the first surface of the RDL substrate, through at least a first pair of conductive pillars. The device also includes a laminate substrate coupled to the first surface of the RDL substrate through at least a second pair of conductive pillars.