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1.发明申请SUBSTRATE TREATMENT DEVICE AND METHOD AND ENCODER SCALE TREATED BY THIS METHOD 审中-公开本方法处理的基板处理装置及方法及编码器规模公开(公告)号：US20150225858A1
公开(公告)日：2015-08-13
申请号：US14696842
申请日：2015-04-27
Applicant: RENISHAW PLC
Abstract: A method of forming an encoder scale for a measurement device is disclosed. The method comprises taking a laser and a substrate carrying an etch-resistant film. Parts of the etch-resistant film are removed by use of the laser, thereby forming a pattern on the substrate that defines an encoder scale, and the substrate is etched through the parts of the etch-resistant film that have been removed by the laser.
Abstract translation: 公开了一种形成用于测量装置的编码器刻度尺的方法。 该方法包括采用带有耐蚀刻膜的激光器和衬底。 通过使用激光去除部分耐蚀刻膜，从而在衬底上形成限定编码器刻度的图案，并且通过已被激光去除的耐蚀刻膜的部分蚀刻衬底。
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