公开(公告)号：US20190224951A1

公开(公告)日：2019-07-25

申请号：US16329293

申请日：2017-07-31

Applicant: RIKEN TECHNOS CORPORATION

Inventor： Yoshihiro ZENNYOJI ,  Sayuri INOMATA

IPC: B32B27/08 ,  B32B27/32 ,  B32B27/36 ,  B32B27/30 ,  B32B7/12 ,  C09J123/08 ,  C09J133/08 ,  C09J133/10 ,  C08K5/00 ,  H01B7/08

Abstract: A resin composition is provided for an adhesive layer of a laminate, the resin composition, containing: (A) 55 to 85 mass % of an acid modified polypropylene-based resin; and (B) 45 to 15 mass % of a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, an alkyl methacrylate, and an alkyl acrylate; in which the total of the component (A) and the component (B) is 100 mass %; and in which an acid modified amount of the component (A) is 0.5 to 10 mol %.