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公开(公告)号:US12189523B2
公开(公告)日:2025-01-07
申请号:US18210387
申请日:2023-06-15
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
Abstract: A memory device having a DRAM core and a register stores first data in the register before receiving first and second memory access commands via a command interface and before receiving second data via a data interface. The memory device responds to the first memory access command by writing the first data from the register to the DRAM core and responds to the second memory access command by writing the second data from the data interface to the DRAM core.
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公开(公告)号:US11720485B2
公开(公告)日:2023-08-08
申请号:US17728791
申请日:2022-04-25
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
CPC classification number: G06F12/023 , G11C7/1006 , G11C7/1039 , G11C7/22 , G11C8/10 , H05K999/99 , G06F2212/2024 , G11C2207/107
Abstract: A memory device having a DRAM core and a register stores first data in the register before receiving first and second memory access commands via a command interface and before receiving second data via a data interface. The memory device responds to the first memory access command by writing the first data from the register to the DRAM core and responds to the second memory access command by writing the second data from the data interface to the DRAM core.
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公开(公告)号:US20250165387A1
公开(公告)日:2025-05-22
申请号:US18968823
申请日:2024-12-04
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
Abstract: A memory device having a DRAM core and a register stores first data in the register before receiving first and second memory access commands via a command interface and before receiving second data via a data interface. The memory device responds to the first memory access command by writing the first data from the register to the DRAM core and responds to the second memory access command by writing the second data from the data interface to the DRAM core.
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公开(公告)号:US11748252B2
公开(公告)日:2023-09-05
申请号:US17540437
申请日:2021-12-02
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
CPC classification number: G06F12/023 , G11C7/1006 , G11C7/1039 , G11C7/22 , G11C8/10 , H05K999/99 , G06F2212/2024 , G11C2207/107
Abstract: A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values.
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公开(公告)号:US20220206936A1
公开(公告)日:2022-06-30
申请号:US17540437
申请日:2021-12-02
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
Abstract: A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values.
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公开(公告)号:US20230325309A1
公开(公告)日:2023-10-12
申请号:US18210387
申请日:2023-06-15
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
CPC classification number: G06F12/023 , G11C7/22 , G11C8/10 , G11C7/1006 , G11C7/1039 , H05K999/99 , G11C2207/107 , G06F2212/2024
Abstract: A memory device having a DRAM core and a register stores first data in the register before receiving first and second memory access commands via a command interface and before receiving second data via a data interface. The memory device responds to the first memory access command by writing the first data from the register to the DRAM core and responds to the second memory access command by writing the second data from the data interface to the DRAM core.
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公开(公告)号:US20220253378A1
公开(公告)日:2022-08-11
申请号:US17728791
申请日:2022-04-25
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
Abstract: A memory device having a DRAM core and a register stores first data in the register before receiving first and second memory access commands via a command interface and before receiving second data via a data interface. The memory device responds to the first memory access command by writing the first data from the register to the DRAM core and responds to the second memory access command by writing the second data from the data interface to the DRAM core.
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公开(公告)号:US11204863B2
公开(公告)日:2021-12-21
申请号:US16735303
申请日:2020-01-06
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
Abstract: A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values.
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公开(公告)号:US20200257619A1
公开(公告)日:2020-08-13
申请号:US16735303
申请日:2020-01-06
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
Abstract: A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values.
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公开(公告)号:US10552310B2
公开(公告)日:2020-02-04
申请号:US15882847
申请日:2018-01-29
Applicant: Rambus Inc.
Inventor: Thomas J. Sheffler , Lawrence Lai , Liang Peng , Bohuslav Rychlik
Abstract: A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values.
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