公开(公告)号：US08786237B2

公开(公告)日：2014-07-22

申请号：US13755812

申请日：2013-01-31

Applicant: Renesas Electronics America Inc.

Inventor： Tetsuo Sato ,  Isao Shimura ,  Tsutomu Kawano

IPC: G05B5/00

CPC classification number: G05D23/1932 ,  G05D23/1931 ,  G05D23/20 ,  G06F1/206 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

Abstract: According to an embodiment of the invention, an apparatus is provided which includes a microprocessor, and a built-in temperature sensor configured to measure a temperature of the microprocessor as a reference temperature. The apparatus further includes external temperature sensors, where at least one of the external temperature sensors is configured to measure the temperature of the microprocessor. The microprocessor is configured to make an external temperature calibration using the reference temperature measured by the built-in temperature monitor. Each of the external temperature sensors is configured to monitor temperature information of a component and provide the temperature information to the microprocessor.

Abstract translation: 根据本发明的实施例，提供了一种装置，其包括微处理器和内置的温度传感器，其被配置为测量微处理器的温度作为参考温度。 该装置还包括外部温度传感器，其中至少一个外部温度传感器被配置成测量微处理器的温度。 微处理器配置为使用由内置温度监测器测量的参考温度进行外部温度校准。 每个外部温度传感器被配置为监视部件的温度信息并将温度信息提供给微处理器。

公开(公告)号：US20130146275A1

公开(公告)日：2013-06-13

申请号：US13755812

申请日：2013-01-31

Applicant: Renesas Electronics America Inc.

Inventor： Tetsuo Sato ,  Isao Shimura ,  Tsutomu Kawano

IPC: G05D23/19

CPC classification number: G05D23/1932 ,  G05D23/1931 ,  G05D23/20 ,  G06F1/206 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

Abstract: According to an embodiment of the invention, an apparatus is provided which includes a microprocessor, and a built-in temperature sensor configured to measure a temperature of the microprocessor as a reference temperature. The apparatus further includes external temperature sensors, where at least one of the external temperature sensors is configured to measure the temperature of the microprocessor. The microprocessor is configured to make an external temperature calibration using the reference temperature measured by the built-in temperature monitor. Each of the external temperature sensors is configured to monitor temperature information of a component and provide the temperature information to the microprocessor.

Abstract translation: 根据本发明的实施例，提供了一种装置，其包括微处理器和内置的温度传感器，其被配置为测量微处理器的温度作为参考温度。 该装置还包括外部温度传感器，其中至少一个外部温度传感器被配置成测量微处理器的温度。 微处理器配置为使用由内置温度监测器测量的参考温度进行外部温度校准。 每个外部温度传感器被配置为监视部件的温度信息并将温度信息提供给微处理器。