公开(公告)号：US20240274595A1

公开(公告)日：2024-08-15

申请号：US18496529

申请日：2023-10-27

Applicant: Renesas Electronics America Inc.

Inventor： Edgardo LABER ,  James Edwin VINSON

IPC: H01L27/02 ,  H01L23/522 ,  H01L23/525

CPC classification number: H01L27/0248 ,  H01L23/5228 ,  H01L23/5256 ,  H01L28/20

Abstract: An integrated circuit is presented. The integrated circuit includes an internal circuit; a contact pad; and a protective element coupled between the internal circuit and the contact pad. The protective element is operable in a first state or a second state. In the first state the protective element passes a current between the internal circuit and the contact pad. When the current is above a threshold value the protective element changes from the first state to the second state to reduce or prevent the current from flowing between the internal circuit and the contact pad. The protective element may be used to prevent damage to an external circuit connected to the integrated circuit.

公开(公告)号：US20240274568A1

公开(公告)日：2024-08-15

申请号：US18496612

申请日：2023-10-27

Applicant: Renesas Electronics America Inc.

Inventor： Edgardo LABER ,  James Edwin VINSON

IPC: H01L23/00 ,  H01L23/62 ,  H02J7/00

CPC classification number: H01L24/48 ,  H01L23/62 ,  H01L24/45 ,  H02J7/0029 ,  H01L23/498 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247

Abstract: A package for use with an integrated circuit having a contact pad is provided. The package includes an enclosure portion; a package pin for external connection; and a protective element coupled between the contact pad and the package pin. The protective element is operable in a first state or a second state. In the first state the protective element passes a current between the contact pad and the package pin. When the current is above a threshold value the protective element changes from the first state to the second state to prevent the current from flowing between the contact pad and the package pin.