公开(公告)号：US08186851B2

公开(公告)日：2012-05-29

申请号：US12628790

申请日：2009-12-01

Applicant: Chia-Cheng Chang ,  Rong-Ming Chang

Inventor： Chia-Cheng Chang ,  Rong-Ming Chang

IPC: F21S4/00

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21Y2107/20 ,  F21Y2113/00 ,  F21Y2115/10

Abstract: A full angle LED (light-emitting diode) illumination device comprises at least three copper base plates, a plurality of LED chips, and a flexible circuit layer. Each copper base plate is electroplated with a layer of silver thereon and the copper base plates are arranged in a crisscross pattern to form the backbone of a three-dimensional globe. Each LED chip is provided on the external surface of the three-dimensional globe at a site where any two copper base plates are crisscrossed. The flexible circuit layer is provided on the peripheries of the copper base plates and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide full angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use.

Abstract translation: 全角LED（发光二极管）照明装置包括至少三个铜基板，多个LED芯片和柔性电路层。 每个铜基板电镀有一层银，铜基板以十字形图案布置以形成三维球体的主链。 每个LED芯片设置在三维球面的外表面上，在任何两个铜基板交叉的位置。 柔性电路层设置在铜基板的周边上，并与用于控制LED芯片的LED芯片电连接。 因此，能够提供全角度照明范围，并提高导热性和散热能力，以便有效延长使用中的LED芯片的使用寿命。

公开(公告)号：US20110108261A1

公开(公告)日：2011-05-12

申请号：US12615042

申请日：2009-11-09

Applicant: Chia-Cheng Chang ,  Rong-Ming Chang

Inventor： Chia-Cheng Chang ,  Rong-Ming Chang

IPC: F28F7/00

CPC classification number: H01L23/38 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A three-layered cold/hot controller comprises a semiconductor plate, a first metal plate, and a second metal plate. The semiconductor plate has a top and a bottom contact surface and connected with a power source. When the semiconductor plate is electrified, the top contact surface of the semiconductor plate forms a contact surface for decreasing temperature while the bottom contact surface of the semiconductor plate forms a contact surface for elevating temperature. The first metal plate is combined to the top contact surface of the semiconductor plate for conducting the heat between the first metal plate and the top contact surface. The second metal plate is combined to the bottom contact surface of the semiconductor plate for conducting the heat between the second metal plate and the bottom contact surface.

Abstract translation: 三层冷/热控制器包括半导体板，第一金属板和第二金属板。 半导体板具有顶部和底部接触表面并与电源连接。 当半导体板通电时，半导体板的顶部接触表面形成用于降低温度的接触表面，同时半导体板的底部接触表面形成用于升高温度的接触表面。 第一金属板组合到半导体板的顶部接触表面，用于在第一金属板和顶部接触表面之间传导热量。 第二金属板组合到半导体板的底部接触表面，用于在第二金属板和底部接触表面之间传导热量。

公开(公告)号：US08193716B2

公开(公告)日：2012-06-05

申请号：US12566932

申请日：2009-09-25

Applicant: Rong-Ming Chang

Inventor： Rong-Ming Chang

IPC: H05B37/00

CPC classification number: H05B33/0815 ,  H05B33/0818

Abstract: A high-power light-emitting diode (LED) driving circuit relates to a photoelectric technology field. An anode of D1 is connected to a constant current direct current (DC) power supply, and a cathode of D1 is connected to LED1, LED4, and one end of R1 and R2. LED1, ED2, and LED3 are connected in serial and then are connected to a collector of Q1, and LED4, LED5, and LED6 are connected in serial and then are connected to a collector of Q2. Emitters of the Q1 and Q2 are grounded. DZ1 is connected to LED1, LED2, and LED3 in parallel, and DZ2 is connected to LED4, LED5, and LED6 in parallel. The other end of R1 is respectively connected to a base of Q1 and one end of C2, and the other end of C2 is connected to the collector of Q2. The other end of R2 is respectively connected to a base of Q2 and one end of C1, and the other end of C1 is connected to the collector of Q1. The driving circuit is capable of completely controlling a temperature of LED chips, avoiding use of a large area of aluminum to dissipate heat, and reducing material cost.

Abstract translation: 大功率发光二极管（LED）驱动电路涉及光电技术领域。 D1的阳极连接到恒流直流（DC）电源，D1的阴极连接到LED1，LED4，R1和R2的一端。 LED1，ED2和LED3串联连接，并连接到Q1的集电极，LED4，LED5和LED6串联连接到Q2的集电极。 Q1和Q2的发射极接地。 DZ1并联LED1，LED2，LED3，DZ2并联LED4，LED5，LED6。 R1的另一端分别连接到Q1的基极和C2的一端，C2的另一端连接到Q2的集电极。 R2的另一端分别连接到Q2的基极和C1的一端，C1的另一端连接到Q1的集电极。 驱动电路能够完全控制LED芯片的温度，避免使用大面积的铝来散热，降低材料成本。

公开(公告)号：US08039851B2

公开(公告)日：2011-10-18

申请号：US12615081

申请日：2009-11-09

Applicant: Rong-Ming Chang

Inventor： Rong-Ming Chang

IPC: H01L29/18

CPC classification number: H05K1/021 ,  F21K9/00 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/0393 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10446 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In the field of opto-electronic technology, a three-dimensional (3D) light-emitting diode (LED) light-emitting plate is described. The 3D LED light-emitting plate includes an aluminum substrate. The aluminum substrate is vertically disposed. Notches are formed on an upper side of the aluminum substrate in a thickness direction. LED chips are mounted in the notches. A flexible circuit layer is disposed on a surface of the aluminum substrate. Each LED chip is connected to a circuit of the flexible circuit layer by a gold wire. A fluorescent colloid light-emitting shell is disposed outside each LED chip correspondingly. A cavity is formed between the LED chip and the fluorescent colloid light-emitting shell. A lower portion of the fluorescent colloid light-emitting shell is fixed on the aluminum substrate. The 3D LED light-emitting plate effectively improves the luminous brightness and efficiency of an LED and enlarges an effective light-emitting angle, and alleviates the problem of non-uniform light pattern and light color, such that an LED white light lamp can achieve the luminous effect of a tungsten lamp. The fluorescent colloid light-emitting shell wraps the LED chip, which not only protects the LED chip from dust and produces white light, but is also suitable for use in a severe environment. Moreover, the production cost is reduced due to the simple structure.

Abstract translation: 在光电技术领域，描述了三维（3D）发光二极管（LED）发光板。 3D LED发光板包括铝基板。 铝基板垂直设置。 在铝基板的厚度方向的上侧形成有切口。 LED芯片安装在凹口中。 柔性电路层设置在铝基板的表面上。 每个LED芯片通过金线连接到柔性电路层的电路。 荧光胶体发光壳相应地设置在每个LED芯片的外侧。 在LED芯片和荧光胶体发光壳体之间形成腔体。 荧光胶体发光壳的下部固定在铝基板上。 3D LED发光板有效地提高了LED的发光亮度和效率，并且扩大了有效的发光角度，并且减轻了不均匀的光图案和浅色的问题，使得LED白光灯可以实现 钨灯的发光效果。 荧光胶体发光壳封装LED芯片，不仅可以保护LED芯片免受灰尘的干扰，还可以产生白光，同时也适用于恶劣环境。 此外，由于结构简单，生产成本降低。