公开(公告)号：US09754914B1

公开(公告)日：2017-09-05

申请号：US15151160

申请日：2016-05-10

Applicant: Rosemount Aerospace Inc.

Inventor： Jim Golden ,  David Barwig

IPC: H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/562 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2224/45099 ,  H01L2924/0715 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20105 ,  H01L2224/05599

Abstract: An integrated circuit is attached to a substrate with a controlled stand-off height, by mounting a plurality of stud bumps of the controlled stand-off height to the substrate at predetermined locations, placing adhesive dots over the stud bumps, placing the integrated circuit on the substrate over the adhesive dots, and applying downward pressure on the integrated circuit until the integrated circuit is in mechanical contact with the stud bumps.