公开(公告)号：US20160101445A1

公开(公告)日：2016-04-14

申请号：US14881847

申请日：2015-10-13

Applicant: Rudolph Technologies, Inc.

Inventor： Jian Ding ,  Priya Mukundhan ,  James Kane ,  Steven Peterson ,  Fei Shen

IPC: B08B7/00 ,  H01L21/02 ,  G01D18/00 ,  H01L21/67

CPC classification number: B08B7/0057 ,  G01D18/00 ,  H01L21/02046 ,  H01L21/67028 ,  H01L21/67115 ,  H01L21/67288 ,  H01L22/12 ,  H01L22/20

Abstract: A method of cleaning calibration and other substrates that improves the correlation of measurements from calibration and product substrates and increases the useful life of the calibration substrates is herein disclosed. By exposing a calibration substrate to ultraviolet light, a reaction is triggered that results in the cleaning of the contaminants from the calibration substrate. For instance, monatomic oxygen is introduced to contaminants on the surface of a calibration substrate to remove the contaminants without inducing modifications in the substrate itself. Through the cleaning process, the temperature of the calibration substrate may be controlled to limit adverse effects caused by the overheating of the calibration substrate.

Abstract translation: 本文公开了一种清洁校准和其它基板的方法，其改进了来自校准和产品基板的测量值的相关性并增加了校准基板的使用寿命。 通过将校准基板暴露于紫外光，触发反应，导致从校准基板清洁污染物。 例如，将单原子氧引入到校准基板的表面上的污染物上以除去污染物，而不引起基板本身的修饰。 通过清洗处理，可以控制校准基板的温度，以限制由校准基板过热引起的不良影响。

公开(公告)号：US10173249B2

公开(公告)日：2019-01-08

申请号：US14881847

申请日：2015-10-13

Applicant: Rudolph Technologies, Inc.

Inventor： Jian Ding ,  Priya Mukundhan ,  James Kane ,  Steven Peterson ,  Fei Shen

IPC: B08B7/00 ,  B08B7/04 ,  H01L21/02 ,  G01D18/00 ,  H01L21/67

Abstract: A method of cleaning calibration and other substrates that improves the correlation of measurements from calibration and product substrates and increases the useful life of the calibration substrates is herein disclosed. By exposing a calibration substrate to ultraviolet light, a reaction is triggered that results in the cleaning of the contaminants from the calibration substrate. For instance, monatomic oxygen is introduced to contaminants on the surface of a calibration substrate to remove the contaminants without inducing modifications in the substrate itself. Through the cleaning process, the temperature of the calibration substrate may be controlled to limit adverse effects caused by the overheating of the calibration substrate.