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公开(公告)号:US10553504B2
公开(公告)日:2020-02-04
申请号:US15933366
申请日:2018-03-22
Applicant: Rudolph Technologies, Inc.
Inventor: Gurvinder Singh , Wu Y. Han , John Thornell , Chetan Suresh , Wayne Fitzgerald
Abstract: Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.
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公开(公告)号:US10466179B2
公开(公告)日:2019-11-05
申请号:US15933362
申请日:2018-03-22
Applicant: Rudolph Technologies, Inc.
Inventor: Gurvinder Singh , Wu Y. Han , John Thornell , Chetan Suresh , Wayne Fitzgerald
Abstract: Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.
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公开(公告)号:US11315832B2
公开(公告)日:2022-04-26
申请号:US16067748
申请日:2016-12-23
Applicant: Rudolph Technologies, Inc.
Inventor: Wayne Fitzgerald
Abstract: A method for monitoring and controlling a substrate singulation process is described. Device edges are imaged and identified for analysis. Discrepancies in device edges are noted and used to modify a singulation process and to monitor the operation of singulation processes for anomalous behavior.
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公开(公告)号:US20190019728A1
公开(公告)日:2019-01-17
申请号:US16067748
申请日:2016-12-23
Applicant: Rudolph Technologies, Inc.
Inventor: Wayne Fitzgerald
Abstract: A method for monitoring and controlling a substrate singulation process is described. Device edges are imaged and identified for analysis. Discrepancies in device edges are noted and used to modify a singulation process and to monitor the operation of singulation processes for anomalous behavior.
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公开(公告)号:US20180277452A1
公开(公告)日:2018-09-27
申请号:US15933366
申请日:2018-03-22
Applicant: Rudolph Technologies, Inc.
Inventor: Gurvinder Singh , Wu Y. Han , John Thornell , Chetan Suresh , Wayne Fitzgerald
CPC classification number: H01L22/20 , G01N21/64 , G01N21/6456 , G01N21/6489 , G01N21/8422 , G01N21/9501 , G01N2021/6417 , G01N2021/8854 , G01N2021/8887 , H01L21/02068 , H01L22/12
Abstract: Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.
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公开(公告)号:US20180275063A1
公开(公告)日:2018-09-27
申请号:US15933362
申请日:2018-03-22
Applicant: Rudolph Technologies, Inc.
Inventor: Gurvinder Singh , Wu Y. Han , John Thornell , Chetan Suresh , Wayne Fitzgerald
CPC classification number: G01N21/6489 , G01B11/0608 , G01B2210/56 , G01N21/6456 , G01N21/8422 , G01N21/8806 , G01N21/8851 , G01N21/9501 , G01N21/9505 , G01N2021/646 , G01N2021/8461 , G01N2021/8822 , G01N2021/8883 , H01L21/67288 , H01L22/12
Abstract: Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.
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