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Patent Agency Ranking
公开(公告)号：US20170367182A1
公开(公告)日：2017-12-21
申请号：US15535087
申请日：2015-12-08
Applicant: SABIC Global Technologies B.V.
Inventor： Tong WU , Wei FENG , Yangang YAN , Wenjia Zhang , Yuxian AN , Xueming Lian , Mahari TJAHJADI
CPC classification number: H05K1/0373 , B32B27/20 , B32B27/32 , B32B27/36 , C08F220/16 , C08K3/2279 , C08K5/0041 , C08K9/02 , C09D4/00 , C23C18/1608 , C23C18/1612 , C23C18/38 , G03F7/0043 , H05K3/185
Abstract: The present disclosure relates to LDS materials comprising a first coating layer comprising a first LDS additive, and a base substrate, wherein the coating layer contacts the base substrate. Articles formed from the LDS materials are also disclosed that include a conductive path and a metal layer deposited on the activated path. Methods for making the LDS materials and corresponding articles are also described.
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2.发明申请公开(公告)号：US20180362758A1
公开(公告)日：2018-12-20
申请号：US16061565
申请日：2016-06-28
Applicant: SABIC Global Technologies B.V.
Inventor： Tong WU , Liang WEN , Anirban GANGULY , Susanta MITRA
Abstract: The present disclosure relates to thermoplastic compositions. The disclosed compositions comprise at least one polycarbonate polymer, at least one polysiloxane-polycarbonate copolymer, at least one laser direct structuring additive, and low levels of at least one oligomeric siloxane additive, the composition exhibiting improved strength and electrical properties. Methods for making the disclosed thermoplastic compositions and the articles of manufacture comprising the disclosed thermoplastic compositions are also disclosed.
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3.发明申请公开(公告)号：US20190322861A1
公开(公告)日：2019-10-24
申请号：US16095887
申请日：2017-04-27
Applicant: SABIC Global Technologies B.V.
Inventor： Zhenke WEI , Tong WU , Yunan CHENG , Qin WANG
Abstract: A thermoplastic composition includes a polymeric base resin, a glass fiber component, and a laser direct structuring additive. The laser direct structuring additive includes copper chromite black, copper hydroxide phosphate, tin-antimony cassiterite grey or a combination thereof. In some aspects the polymeric base resin includes polybutylene terephthalate (PBT), polyamide (PA), polycarbonate (PC), poly(p-phenylene oxide) (PPO), or combinations thereof. In certain aspects the thermoplastic composition has a nano molding technology (NMT) bonding strength of at least about 20 MPa when bonded to aluminum alloy. In further aspects the thermoplastic composition includes a plating index of at least a about 0.25. The disclosed thermoplastic compositions can be used to form articles such as NMT bonded covers of consumer electronics devices.
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公开(公告)号：US20180065392A1
公开(公告)日：2018-03-08
申请号：US15551808
申请日：2016-02-19
Applicant: SABIC Global Technologies B.V.
Inventor： Tong WU , Mingcheng GUO , Jiwen WANG , Xiaofeng YU
CPC classification number: B41M5/267 , C08K3/013 , C08K3/22 , C08K3/32 , C08K9/06 , C08K2003/2241 , C08K2003/2248 , C08K2003/321 , C08K2003/328 , C08L77/02 , C08L77/06 , C08L79/08 , C08L101/00
Abstract: The disclosure concerns polymer compositions exhibiting thermal conductivity and laser marking properties while maintaining mechanical properties and a light color throughout the composition.
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公开(公告)号：US20170361584A1
公开(公告)日：2017-12-21
申请号：US15535113
申请日：2015-12-08
Applicant: SABIC Global Technologies B.V.
Inventor： Wei FENG , Mahari TJAHJADI , Tong WU , Yuxian AN
CPC classification number: B32B27/08 , C08K3/10 , C08K3/32 , C08K2003/321 , H05K1/0373 , H05K3/00 , H05K3/0014 , H05K3/185 , H05K2201/0209 , H05K2201/0236 , H05K2203/107
Abstract: This disclosure relates to materials prepared using a laser-direct structuring (LDS) method. The LDS materials of the present disclosure comprise polymeric film or polymeric sheet structures containing a LDS additive and which can undergo laser-direct structuring and chemical plating to form conductive paths on their surface. The present disclosure finds use, for example, in the automotive, electronics, RFID, communications, and medical device industries.
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