公开(公告)号：US20150124417A1

公开(公告)日：2015-05-07

申请号：US14289932

申请日：2014-05-29

Applicant: SAE Magnetics (H.K.) Ltd.

Inventor： Akio NAKAO ,  Hidenobu TAKEMOTO

IPC: H05K1/18

CPC classification number: H05K3/284 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K9/0024 ,  H05K9/0045 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2201/2072

Abstract: An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules.

Abstract translation: 电子部件封装包括具有至少一个电子电路的基板; 用于密封电子电路的密封树脂，至少一个其上形成有至少一个裂纹的填料被填充在密封中; 以及形成在密封树脂的顶表面上的金属膜，金属膜的根部嵌入在填料上的裂纹中。 电子元件封装可以屏蔽环境电磁噪声，满足集成电路模块的轻量化要求。

公开(公告)号：US20160278202A1

公开(公告)日：2016-09-22

申请号：US14978709

申请日：2015-12-22

Applicant: SAE MAGNETICS (H.K.) LTD.

Inventor： Akio NAKAO

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/284 ,  H01L21/561 ,  H01L21/568 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/15159 ,  H01L2924/15313 ,  H05K1/0218 ,  H05K3/0097 ,  H05K2201/0317 ,  H05K2201/0715 ,  H05K2201/09145 ,  H05K2201/09845

Abstract: An electronic component module includes a substrate; at least one electronic component mounted on an electronic component mounting surface of the substrate; an insulating body covering the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by sputtering, the metal film covering at least one exterior surface of the insulating body and at least one side surface of the substrate. The substrate has a recess portion formed on a periphery of the surface of the substrate that is opposite to the electronic component mounting surface, and the recess portion has a top surface parallel to the electronic component mounting surface and a side surface perpendicular to the top surface, and the metal film is extended to cover the top surface of the recess portion, without covering the side surface thereof. It obtains improved electromagnetic wave shielding effect and improved manufacturing efficiency.

Abstract translation: 电子部件模块包括基板; 安装在所述基板的电子部件安装表面上的至少一个电子部件; 覆盖基板的电子部件安装面上的电子部件的绝缘体; 以及通过溅射形成的金属膜，所述金属膜覆盖所述绝缘体的至少一个外表面和所述基板的至少一个侧表面。 基板具有形成在基板表面的与电子部件安装面相反的周边的凹部，凹部具有平行于电子部件安装面的上表面和与顶面垂直的侧面 并且金属膜延伸以覆盖凹部的顶表面而不覆盖其侧表面。 获得改进的电磁波屏蔽效果，提高制造效率。