公开(公告)号：US20140376157A1

公开(公告)日：2014-12-25

申请号：US13966474

申请日：2013-08-14

Applicant: SAMHWA CAPACITOR CO., LTD.

Inventor： Young Joo OH ,  Jung Rag YOON ,  Kyung Min LEE ,  Young Min YOO

IPC: H01G9/28

CPC classification number: H01G2/04 ,  H02M7/003 ,  Y02T10/7022

Abstract: A power electronic capacitor module for vehicle that may reduce the number of solderings by inserting and thereby mounting a capacitor between a single pair of bus bars and thereby may simplify an assembly process. The power electronic capacitor module for vehicle may include a single pair of bus bars disposed to be separate from each other and each having an external electrode support member; an insulating support frame formed to expose the external electrode support member and wrap around a single pair of bus bars and thereby support the bus bars; and a capacitor element having a single pair of external electrodes and inserted between a single pair of bus bars to thereby be supported by the bus bars or the external electrode support members and electrically connect the external electrodes to the external electrode support members.

Abstract translation: 一种用于车辆的电力电子电容器模块，其可以通过插入并由此在单对汇流条之间安装电容器来减少焊接的数量，从而可以简化组装过程。 用于车辆的电力电子电容器模块可以包括设置成彼此分离并且每个具有外部电极支撑构件的单对汇流条; 绝缘支撑框架，被形成为暴露外部电极支撑构件并围绕一对母线缠绕，从而支撑汇流条; 以及电容器元件，其具有单对外部电极并且插入在单对汇流条之间，由汇流条或外部电极支撑构件支撑，并将外部电极电连接到外部电极支撑构件。

公开(公告)号：US20180190434A1

公开(公告)日：2018-07-05

申请号：US15399029

申请日：2017-01-05

Applicant: SAMHWA CAPACITOR CO., LTD.

Inventor： Young Joo OH ,  Jung Rag YOON ,  Young Min YOO

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  H01G4/012 ,  H01G4/242 ,  H01G4/258

CPC classification number: H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/242 ,  H01G4/258

Abstract: A multi-layer ceramic capacitor assembly includes a first terminal assembly member formed by arranging first protruded members at specific intervals, a second terminal assembly member formed by arranging second protruded members at specific intervals so that they face the respective first protruded members, insulated heat dissipation members supported by the first protruded members and the second protruded members and disposed therein, and multi-layer ceramic capacitors alternately disposed between the insulated heat dissipation members so that each multi-layer ceramic capacitor comes into contact with one side and the other side of each insulated heat dissipation member in a first direction, the end on one side of the multi-layer ceramic capacitor in a second direction orthogonal to the first direction is connected to the first terminal assembly member, and the end on the other side of the multi-layer ceramic capacitor in the second direction is connected to the second terminal assembly member.

公开(公告)号：US20140085772A1

公开(公告)日：2014-03-27

申请号：US14014773

申请日：2013-08-30

Applicant: SAMHWA CAPACITOR CO., LTD.

Inventor： Young Joo OH ,  Jung Rag YOON ,  Kyung Min LEE ,  Young Min YOO

IPC: H01G4/38

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/40 ,  H05K1/0231 ,  H05K1/116 ,  H05K3/306 ,  H05K3/4641 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09718 ,  H05K2201/1034 ,  Y02T10/7022

Abstract: A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.

Abstract translation: 直流（DC）链路电容器模块包括通过顺序地布置第一电极基板，绝缘基板，第二电极基板，第三电极基板形成的印刷电路板（PCB） 与第一电极基板和第二电极基板中的每一个并联连接的多个DC链路电容器; 多个第一Y电容器，与第一电极基板和第三电极基板中的每一个串联连接，并联连接到直流链路电容器; 以及与第一电极基板和第三电极基板中的每一个串联连接并与第一Y电容器并联连接的多个第二Y电容器，从而实现小型化，并且通过将多个DC链路 电容使用PCB。