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公开(公告)号：US20230386742A1
公开(公告)日：2023-11-30
申请号：US18232050
申请日：2023-08-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： A Ra Cho , Dong Hwi Shin , Seon Young Yoo
CPC classification number: H01G4/008 , H05K1/111 , H01G4/30 , H01G4/232 , H05K1/181 , H05K2201/10015
Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.
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Patent Agency Ranking
公开(公告)号：US11776755B2
公开(公告)日：2023-10-03
申请号：US17060374
申请日：2020-10-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Duk Yun , Seonyoung Yoo , Hong Gi Kim , Byeongguk Choi , Young Hoon Song , Yuseop Lee , A Ra Cho , Donghwi Shin
CPC classification number: H01G4/30 , H01G4/008 , H01G4/012 , H01G4/1218 , H01G4/2325
Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer, and a capacitance forming portion disposed in such a manner that first and second internal electrodes are stacked with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the ceramic body, respectively, the first and second external electrodes including first and second base electrodes connected to the first and second internal electrodes, respectively, and first and second conductive layers disposed to cover the first and second base electrodes, respectively. The first and second conductive layers have a thickness in a range of 0.1 μm to 10 μm.
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公开(公告)号：US11763987B2
公开(公告)日：2023-09-19
申请号：US17356110
申请日：2021-06-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： A Ra Cho , Dong Hwi Shin , Seon Young Yoo
CPC classification number: H01G4/008 , H01G4/232 , H01G4/30 , H05K1/111 , H05K1/181 , H05K2201/10015
Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.
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公开(公告)号：US20220208451A1
公开(公告)日：2022-06-30
申请号：US17356110
申请日：2021-06-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： A Ra Cho , Dong Hwi Shin , Seon Young Yoo
Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.
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公开(公告)号：US12224121B2
公开(公告)日：2025-02-11
申请号：US18232050
申请日：2023-08-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： A Ra Cho , Dong Hwi Shin , Seon Young Yoo
Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.
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公开(公告)号：US20240290540A1
公开(公告)日：2024-08-29
申请号：US18437561
申请日：2024-02-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Duk Yun , Byung Jun Jeon , Chae Min Park , Yong Won Seo , Ho In Jun , A Ra Cho
CPC classification number: H01G4/0085 , H01G4/2325 , H01G4/30
Abstract: Provided is a multilayer electronic component according to an example embodiment of the present disclosure including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including Ni; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a base electrode layer including Ni and Pd, and the internal electrode includes a first region, and a content of Pd included in the first region is greater than a content of Pd included in a remaining region, excluding the first region in the internal electrode.
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