公开(公告)号：US11812552B2

公开(公告)日：2023-11-07

申请号：US17221159

申请日：2021-04-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chul Mun Kang ,  Sang Jong Lee ,  Hyun Sang Kwak ,  Chi Hyeon Jeong ,  Seong Hwan Lee

IPC: H05K1/02

CPC classification number: H05K1/0298 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0227 ,  H05K1/0221 ,  H05K2201/0715

Abstract: A printed circuit board, includes: a first insulating layer on which a wiring line is disposed; a second insulating layer covering an upper portion of the wiring line; a first conductive shield wall spaced apart from two opposing sides of the wiring line in a width direction of the wiring line, and extending in a length direction of the wiring line; and a second conductive shield wall spaced apart from two opposing ends of the first conductive shield wall in the length direction, and extending the a width direction. At least one of the first conductive shield wall or the second conductive shield wall includes a plurality of via walls each extending in a thickness direction of the first insulating layer and the second insulating layer and having a gap is disposed therebetween.

公开(公告)号：US20220192014A1

公开(公告)日：2022-06-16

申请号：US17221159

申请日：2021-04-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chul Mun Kang ,  Sang Jong Lee ,  Hyun Sang Kwak ,  Chi Hyeon Jeong ,  Seong Hwan Lee

IPC: H05K1/02

Abstract: A printed circuit board, includes: a first insulating layer on which a wiring line is disposed; a second insulating layer covering an upper portion of the wiring line; a first conductive shield wall spaced apart from two opposing sides of the wiring line in a width direction of the wiring line, and extending in a length direction of the wiring line; and a second conductive shield wall spaced apart from two opposing ends of the first conductive shield wall in the length direction, and extending the a width direction. At least one of the first conductive shield wall or the second conductive shield wall includes a plurality of via walls each extending in a thickness direction of the first insulating layer and the second insulating layer and having a gap is disposed therebetween.