公开(公告)号：US20140151104A1

公开(公告)日：2014-06-05

申请号：US14090469

申请日：2013-11-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yul Kyo CHUNG ,  DOO HWAN LEE ,  SEUNG EUN LEE ,  YEE NA SHIN

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/186 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/09645 ,  H05K2203/0228 ,  H05K2203/0242 ,  Y10T29/49139

Abstract: The present invention relates to an electronic component embedded substrate including: a cavity formed in at least one insulating layer provided inside the electronic component embedded substrate; an electronic component having at least a portion inserted in the cavity; and a cavity plating portion formed on a surface of the cavity opposite to at least one surface of the electronic component, and can improve electrical connectivity between an external electrode and a via even when the size of the external electrode of the electronic component is reduced than before.

Abstract translation: 电子部件嵌入式基板技术领域本发明涉及一种电子部件嵌入式基板，包括：形成在设置在电子部件嵌入基板的内部的至少一个绝缘层内的空腔; 电子部件，其具有插入到所述空腔中的至少一部分; 以及形成在与所述电子部件的至少一个表面相对的所述空腔的表面上的空腔镀敷部，并且即使当所述电子部件的外部电极的尺寸比所述电子部件的尺寸小的情况下，也能够提高外部电极和通孔之间的电连接性 之前。