公开(公告)号：US20220408559A1

公开(公告)日：2022-12-22

申请号：US17688219

申请日：2022-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee-Joon CHUN ,  Jae Sung SIM ,  Hak Young LEE ,  Kwang Hee KWON ,  Hee Jung JUNG

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00

Abstract: A printed circuit board includes: a first insulating layer; a first metal layer disposed on one surface of the first insulating layer; a second metal layer disposed on the other surface facing the one surface of the first insulating layer; a via penetrating through the first insulating layer to connect the first and second metal layers to each other; and a heterogeneous metal region disposed in at least one of an area in which the via is adjacent to the first insulating layer and an area in which the via is adjacent to the first metal layer, and including a material different from that of the via, wherein the heterogeneous metal region includes at least one of nickel (Ni), silicon (Si), and titanium (Ti).

公开(公告)号：US20190229070A1

公开(公告)日：2019-07-25

申请号：US16105956

申请日：2018-08-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yi Eok KWON ,  Jae Ean LEE ,  Hak Young LEE

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367 ,  H01L25/065

Abstract: A fan-out semiconductor package includes: a semiconductor chip; a redistribution portion disposed below the semiconductor chip; a reinforcing member disposed on the redistribution portion and surrounding the semiconductor chip; and an encapsulant disposed on the redistribution portion to embed the semiconductor chip and the reinforcing member therein.