公开(公告)号：US20150373841A1

公开(公告)日：2015-12-24

申请号：US14746308

申请日：2015-06-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon CHO ,  Yong Sam LEE ,  Tae Hong MIN ,  Young Gwan KO ,  Yoong OH ,  Joon Sung LEE

IPC: H05K1/02 ,  C03B33/02 ,  H05K3/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K3/4605 ,  C03B33/074 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/09827 ,  Y10T83/0207 ,  Y10T428/24488

Abstract: A printed circuit board, according to one embodiment, includes: a core having a slope pattern formed on a side surface thereof; a first insulating layer laminated on the core; a second insulating layer laminated on the first insulating layer to cover the side surface of the core; an inner circuit layer and an outer circuit layer respectively formed on the first insulating layer and the second insulating layer; and a solder resist layer laminated on the second insulating layer.

Abstract translation: 根据一个实施例的印刷电路板包括：具有形成在其侧表面上的斜面图案的芯; 层叠在所述芯上的第一绝缘层; 层叠在所述第一绝缘层上以覆盖所述芯的侧表面的第二绝缘层; 分别形成在所述第一绝缘层和所述第二绝缘层上的内电路层和外电路层; 以及层叠在第二绝缘层上的阻焊层。