公开(公告)号：US20140034357A1

公开(公告)日：2014-02-06

申请号：US13955474

申请日：2013-07-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang-Kyung LEE ,  Hee-Kyoung Lee ,  Dong-Hwan Lee ,  Kyung-Sang Lim

IPC: H05K1/02

CPC classification number: H05K1/0242 ,  H05K1/0219 ,  H05K1/0233 ,  H05K2201/086 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/0979

Abstract: A printed circuit board disclosed. One embodiment of the present invention provides a printed circuit board that includes: an insulation layer having multiple layers of circuit wirings formed therein; a via formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in such a way that an inside thereof is hollow; and an electromagnetic wave absorbing part contained in the via.

Abstract translation: 公开了印刷电路板。 本发明的一个实施例提供了一种印刷电路板，其包括：绝缘层，其中形成有多层电路布线; 沿绝缘层的周边形成的通孔，其被构造用于连接形成在绝缘层的不同层上的电路布线，所述通孔以使其内部为中空的方式形成; 以及包含在通孔中的电磁波吸收部。