公开(公告)号：US20190164933A1

公开(公告)日：2019-05-30

申请号：US16008810

申请日：2018-06-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Ho LEE

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers and the connection pads to each other. The connection pads of the semiconductor chip are electrically connected to the redistribution layer of the connection member through wire posts disposed on the connection pads of the semiconductor chip.

公开(公告)号：US20190131221A1

公开(公告)日：2019-05-02

申请号：US15913429

申请日：2018-03-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Ean LEE ,  Tae Sung JEONG ,  Young Gwan KO ,  Suk Ho LEE ,  Jung Soo BYUN

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48

Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

公开(公告)号：US20140035157A1

公开(公告)日：2014-02-06

申请号：US13688430

申请日：2012-11-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Si Joong YANG ,  Joon Seok CHAE ,  Tae Hyun KIM ,  Suk Ho LEE

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L23/481 ,  H01L21/561 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00

Abstract: There is provided a semiconductor package including: at least one internal lead having at least one electronic component mounted on a surface thereof; a molding unit sealing the electronic component and the internal lead; at least one external lead extending from the internal lead and protruding outwardly from ends of the molding unit; and a stopper provided on the external lead.

Abstract translation: 提供一种半导体封装，包括：至少一个内部引线，其具有安装在其表面上的至少一个电子部件; 密封电子部件和内部引线的成型单元; 从所述内部引线延伸并从所述模制单元的端部向外突出的至少一个外部引线; 以及设置在外部引线上的止动件。