公开(公告)号：US20150027760A1

公开(公告)日：2015-01-29

申请号：US14086500

申请日：2013-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS., LTD.

Inventor： Seong Min CHO ,  Jung Youn PANG ,  Eun Heay LEE ,  Seung Min KANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/18

CPC classification number: H05K3/3457 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/09663 ,  Y02P70/611

Abstract: A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. Further, a printed circuit board may include an insulating layer; a metal seed layer formed on the insulating layer; a metal pad formed on the metal seed layer; a surface treatment layer formed on the metal pad and the metal seed layer; a solder layer formed on the surface treatment layer of the metal pad and the surface treatment layer of the metal seed layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer.

Abstract translation: 印刷电路板包括绝缘层; 形成在所述绝缘层上的金属焊盘; 形成在所述金属垫上的表面处理层; 形成在表面处理层和绝缘层上的焊料层; 以及在焊料层和表面处理层之间形成的金属间化合物层。 此外，印刷电路板可以包括绝缘层; 形成在所述绝缘层上的金属籽晶层; 形成在金属籽晶层上的金属垫; 形成在所述金属焊盘和所述金属种子层上的表面处理层; 在金属焊盘的表面处理层和金属种子层的表面处理层上形成的焊料层; 以及在焊料层和表面处理层之间形成的金属间化合物层。