OUTDOOR UNIT OF AIR CONDITIONER
    1.
    发明公开

    公开(公告)号:US20230168004A1

    公开(公告)日:2023-06-01

    申请号:US18101397

    申请日:2023-01-25

    CPC classification number: F24F13/32 F24F1/56

    Abstract: An outdoor unit of an air conditioner, including a cabinet including a base panel and a side panel; a compressor supported by the cabinet; a heat exchanger supported by the cabinet; and a leg frame at a lower end of the cabinet to support the cabinet. The leg frame includes: a channel including an upper flange coupled to the base panel, a lower flange installable on an installation surface, and a web connecting the upper flange with the lower flange. A first coupling portion and a second coupling portion are configured to fix one side portion of the channel to the side panel, and are positioned on opposite sides with the channel interposed therebetween.

    METHOD AND DEVICE FOR DEVICE DISCOVERY USING UWB

    公开(公告)号:US20220210631A1

    公开(公告)日:2022-06-30

    申请号:US17560944

    申请日:2021-12-23

    Abstract: The disclosure relates to a method and a device for device discovery using ultra-wideband (UWB). A method for a first UWB includes transmitting a control message including information on a contention window for contention-based access by using a UWB communication scheme; receiving a scheduling request message for scheduling-based access, in a slot in the contention window from a second UWB device by using the UWB communication scheme; and configuring a scheduled slot for the second UWB device, based on the scheduling request message. The scheduling request message may be used for in-band device discovery.

    SEMICONDUCTOR DEVICE
    3.
    发明申请

    公开(公告)号:US20210118880A1

    公开(公告)日:2021-04-22

    申请号:US16896423

    申请日:2020-06-09

    Abstract: A semiconductor device including a substrate; a first active pattern on the substrate and extending in a first direction, an upper portion of the first active pattern including a first channel pattern; first source/drain patterns in recesses in an upper portion of the first channel pattern; and a gate electrode on the first active pattern and extending in a second direction crossing the first direction, the gate electrode being on a top surface and on a side surface of the at least one first channel pattern, wherein each of the first source/drain patterns includes a first, second, and third semiconductor layer, which are sequentially provided in the recesses, each of the first channel pattern and the third semiconductor layers includes silicon-germanium (SiGe), and the first semiconductor layer has a germanium concentration higher than those of the first channel pattern and the second semiconductor layer.

    SEMICONDUCTOR DEVICE
    6.
    发明公开

    公开(公告)号:US20230246029A1

    公开(公告)日:2023-08-03

    申请号:US18133156

    申请日:2023-04-11

    CPC classification number: H01L27/092 H01L29/161

    Abstract: A semiconductor device including a substrate; a first active pattern on the substrate and extending in a first direction, an upper portion of the first active pattern including a first channel pattern; first source/drain patterns in recesses in an upper portion of the first channel pattern; and a gate electrode on the first active pattern and extending in a second direction crossing the first direction, the gate electrode being on a top surface and on a side surface of the at least one first channel pattern, wherein each of the first source/drain patterns includes a first, second, and third semiconductor layer, which are sequentially provided in the recesses, each of the first channel pattern and the third semiconductor layers includes silicon-germanium (SiGe), and the first semiconductor layer has a germanium concentration higher than those of the first channel pattern and the second semiconductor layer.

    METHOD AND DEVICE FOR SERVICE NEGOTIATION
    7.
    发明申请
    METHOD AND DEVICE FOR SERVICE NEGOTIATION 审中-公开
    服务协商的方法和设备

    公开(公告)号:US20150004908A1

    公开(公告)日:2015-01-01

    申请号:US14317725

    申请日:2014-06-27

    CPC classification number: H04W76/10 H04W76/14

    Abstract: A method and an electronic device for service negotiation are provided. The method includes sensing, by the electronic device, a counterpart device through a first protocol, transmitting a request message to the counterpart device through the first protocol, the request message including indication information indicating that the electronic device requests a first service and first service information regarding the first service, and connecting with the counterpart device through a second protocol, when a selection message including indication information selecting the first service is received from the counterpart device through the first protocol, and, after connecting through the second protocol, executing the first service with the counterpart device using the first service information. The request message and the selection message each includes connection information for a connection using the second protocol, and the electronic device and the counterpart device use the connection information to perform the connection using the second protocol.

    Abstract translation: 提供了一种用于服务协商的方法和电子设备。 该方法包括:通过电子设备通过第一协议检测对方设备,通过第一协议向对方设备发送请求消息,所述请求消息包括指示电子设备请求第一服务的指示信息和第一服务信息 关于第一服务,并且通过第二协议与对方设备连接,当通过第一协议从对方设备接收到包括选择第一服务的指示信息的选择消息时,并且在连接到第二协议之后,执行第一服务 使用第一服务信息与对方设备进行服务。 请求消息和选择消息各自包括使用第二协议的连接的连接信息,并且电子设备和对方设备使用连接信息来执行使用第二协议的连接。

    SEMICONDUCTOR DEVICES
    8.
    发明申请

    公开(公告)号:US20250169059A1

    公开(公告)日:2025-05-22

    申请号:US18815929

    申请日:2024-08-27

    Abstract: A semiconductor device includes a lower structure including conductive regions; a capacitor including first electrode structures electrically connected to the conductive regions of the lower structure, a dielectric layer covering the first electrode structures, and a second electrode structure on the dielectric layer; and an upper support pattern in contact with the first electrode structures, wherein each of the first electrode structures includes a first electrode region extending vertically; and a second electrode region extending upwardly from the first electrode region and having a side surface not vertically aligned with a side surface of the first electrode region, and wherein the upper support pattern includes a first layer covering upper surfaces of the second electrode regions of the first electrode structures and connected to each other; and a second layer on the first layer and including a material different from a material of the first layer.

    METHOD AND DEVICE FOR CONNECTING DEVICE TO SERVICE

    公开(公告)号:US20250141972A1

    公开(公告)日:2025-05-01

    申请号:US18837755

    申请日:2023-02-21

    Abstract: The present disclosure provides a method by which an electronic device uses an auxiliary device so as to connect an IoT device to an IoT service. The method of the present disclosure may comprise the steps of: receiving, from an IoT device, basic information about the IoT device through an auxiliary device; discovering, on the basis of the basic information, the IoT device by using one from among one or more discovery methods; and registering the discovered IoT device with the IoT service.

    PAYMENT METHOD AND DEVICE USING ULTRA-WIDEBAND COMMUNICATION

    公开(公告)号:US20240086890A1

    公开(公告)日:2024-03-14

    申请号:US18276549

    申请日:2022-02-10

    CPC classification number: G06Q20/325 G06Q20/3674 G06Q20/3829 G06Q2220/00

    Abstract: The present disclosure discloses a method for a UWB-based payment service. A method of a first electronic device using UWB communication, of the present disclosure, may comprise the operations of: receiving, from a second electronic device, an initiation message for UWB ranging, which includes a random number generated by means of the second electronic device, transmitting, to the second electronic device, a response message to the initiation message, which includes identification information about the first electronic device encrypted using a session key generated on the basis of the random number, receiving, from the second electronic device, a transaction information message including request type information indicating the type of request associated with a payment, and transmitting, to the second electronic device, a payment information message including response data based on the request type information.

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