公开(公告)号：US20130168349A1

公开(公告)日：2013-07-04

申请号：US13727038

申请日：2012-12-26

Applicant: Samsung Techwin Co., Ltd.

Inventor： Soon Chul KWON ,  Sang Min LEE

IPC: H05K3/22

CPC classification number: H05K3/22 ,  H05K3/0017 ,  H05K3/427 ,  H05K2203/0285 ,  H05K2203/0746 ,  H05K2203/0783

Abstract: A method of forming a via hole in a circuit board including an insulating layer and a metal layer disposed on each of top and bottom surfaces of the insulating layer, the method including: selectively removing a portion of each of the metal layers where the via hole is to be formed thereby exposing the insulating layer; and removing the exposed insulating layer, wherein the removing of the exposed insulating layer includes chemically swelling the exposed insulating layer and removing the swollen insulating layer.

Abstract translation: 一种在包括绝缘层和设置在绝缘层的顶表面和底表面中的每一个上的金属层的电路板中形成通孔的方法，所述方法包括：选择性地去除每个金属层的通孔中的一部分 由此形成绝缘层; 去除暴露的绝缘层，其中去除暴露的绝缘层包括使暴露的绝缘层化学膨胀并除去膨胀的绝缘层。

公开(公告)号：US20130105214A1

公开(公告)日：2013-05-02

申请号：US13665063

申请日：2012-10-31

Applicant: SAMSUNG TECHWIN CO., LTD.

Inventor： Soon Chul KWON ,  Sang Min LEE

IPC: H05K3/06 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K3/06 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/4007 ,  H05K2201/0352 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Provided is a method for manufacturing a circuit board provided with metal posts formed on at least one surface of the circuit board, the method including preparing a substrate made of a conductive material, performing a first selective etching a first surface of the substrate in regions corresponding to insulating portions of a first circuit pattern, laminating a first insulating layer over the first surface of the substrate, and performing a second etching on a second surface opposite of the first surface of the substrate, thereby forming the metal posts and the first circuit.

Abstract translation: 提供一种制造电路板的方法，该电路板设置有形成在电路板的至少一个表面上的金属柱，该方法包括制备由导电材料制成的衬底，在对应的区域中进行第一选择性蚀刻衬底的第一表面 绝缘部分的第一电路图案，在基板的第一表面上层叠第一绝缘层，并且在与基板的第一表面相对的第二表面上执行第二蚀刻，由此形成金属柱和第一电路。