公开(公告)号：US12100647B2

公开(公告)日：2024-09-24

申请号：US17765365

申请日：2020-09-30

Applicant: SAMTEC, INC.

Inventor： Alan D. Nolet ,  Andrew Haynes Liotta ,  Troy Benton Holland ,  Thomas Jacob Hammann ,  Heidi Bates ,  Daniel Goia ,  Vishwas Vinayak Hardikar ,  Ajeet Kumar ,  Daniel Long ,  Nicole McGraw ,  Lauren Savawn Moen ,  Adam Owens

IPC: H01L23/15 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49866 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H05K1/0306 ,  H05K1/115

Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

公开(公告)号：US11107702B2

公开(公告)日：2021-08-31

申请号：US16924600

申请日：2020-07-09

Applicant: Samtec, Inc.

Inventor： Fred Koelling ,  Alan D. Nolet ,  Daniel Long

IPC: H01L21/48 ,  H01L23/498 ,  B22F7/08 ,  B22F3/15 ,  B22F1/02 ,  H01L23/15

Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.

公开(公告)号：US10593562B2

公开(公告)日：2020-03-17

申请号：US15861518

申请日：2018-01-03

Applicant: SAMTEC, INC.

Inventor： Fred Koelling ,  Alan P. Nolet ,  Daniel Long

IPC: H01L21/48 ,  H01L23/498 ,  B22F7/08 ,  B22F3/15 ,  B22F1/02 ,  H01L23/15

Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.

公开(公告)号：US20250014983A1

公开(公告)日：2025-01-09

申请号：US18886066

申请日：2024-09-16

Applicant: SAMTEC, INC.

Inventor： Alan D. Nolet ,  Andrew Haynes Liotta ,  Troy Benton Holland ,  Thomas Jacob Hammann ,  Heidi Bates ,  Daniel Goia ,  Vishwas Vinayak Hardikar ,  Ajeet Kumar ,  Daniel Long ,  Nicole McGraw ,  Lauren Savawn Moen ,  Adam Owens

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/11

Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

公开(公告)号：US12009225B2

公开(公告)日：2024-06-11

申请号：US17043998

申请日：2019-03-29

Applicant: SAMTEC, INC.

Inventor： Alan Nolet ,  Daniel Goia ,  Vishwas Hardikar ,  Ajeet Kumar ,  Daniel Long ,  Andrew Liotta

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/15

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/15

Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

公开(公告)号：US20200343105A1

公开(公告)日：2020-10-29

申请号：US16924600

申请日：2020-07-09

Applicant: Samtec, Inc.

Inventor： Fred Koelling ,  Alan D. Nolet ,  Daniel Long

IPC: H01L21/48 ,  H01L23/498 ,  B22F7/08 ,  B22F3/15 ,  B22F1/02

Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.

公开(公告)号：US10727084B2

公开(公告)日：2020-07-28

申请号：US16778603

申请日：2020-01-31

Applicant: Samtec, Inc.

Inventor： Fred Koelling ,  Alan D. Nolet ,  Daniel Long

IPC: H01L21/48 ,  B22F1/02 ,  B22F3/15 ,  H01L23/498 ,  B22F7/08 ,  H01L23/15

Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.

公开(公告)号：US20200168474A1

公开(公告)日：2020-05-28

申请号：US16778603

申请日：2020-01-31

Applicant: Samtec, Inc.

Inventor： Fred Koelling ,  Alan D. Nolet ,  Daniel Long

IPC: H01L21/48 ,  B22F1/02 ,  B22F3/15 ,  B22F7/08 ,  H01L23/498

Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.