公开(公告)号：US11171432B2

公开(公告)日：2021-11-09

申请号：US16325456

申请日：2017-08-15

Applicant: SAMTEC INC.

Inventor： Liam Parkes ,  Eric Zbinden ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  R. Brad Bettman

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/77 ,  H01R12/83 ,  H01R13/639

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

公开(公告)号：USD924170S1

公开(公告)日：2021-07-06

申请号：US29733196

申请日：2020-04-30

Applicant: Samtec, Inc.

Designer： Jean Karlo Williams Barnett ,  Jignesh H. Shah ,  Eric Zbinden

公开(公告)号：US20220029323A1

公开(公告)日：2022-01-27

申请号：US17496558

申请日：2021-10-07

Applicant: SAMTEC INC.

Inventor： Liam PARKES ,  Eric ZBINDEN ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  R. Brad Bettman

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/77 ,  H01R12/83 ,  H01R13/639

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

公开(公告)号：US10892585B2

公开(公告)日：2021-01-12

申请号：US16345316

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： Jignesh Shah ,  Jean Karlo Williams Barnett ,  Eric Zbinden

IPC: H01R13/631 ,  H01R13/627 ,  G02B6/42 ,  H01R12/71

Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.

公开(公告)号：USD960107S1

公开(公告)日：2022-08-09

申请号：US29797618

申请日：2021-07-01

Applicant: Samtec, Inc.

Designer： Jean Karlo Williams Barnett ,  Jignesh H. Shah ,  Eric Zbinden

公开(公告)号：USD886066S1

公开(公告)日：2020-06-02

申请号：US29628702

申请日：2017-12-06

Applicant: Samtec, Inc.

Designer： Jean Karlo Williams Barnett ,  Jignesh H. Shah ,  Eric Zbinden

公开(公告)号：US11735844B2

公开(公告)日：2023-08-22

申请号：US17496558

申请日：2021-10-07

Applicant: SAMTEC INC.

Inventor： Liam Parkes ,  Eric Zbinden ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  R. Brad Bettman

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/77 ,  H01R12/83 ,  H01R13/639 ,  H01R13/629

CPC classification number: H01R12/7029 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4277 ,  H01R12/7058 ,  H01R12/774 ,  H01R12/83 ,  H01R13/629 ,  H01R13/639

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

公开(公告)号：US11196195B2

公开(公告)日：2021-12-07

申请号：US16604023

申请日：2018-04-10

Applicant: SAMTEC, INC.

Inventor： R. Brad Bettman ,  Liam Parkes ,  Eric Zbinden ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  Edwin Loy

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/73

Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.

公开(公告)号：USD822611S1

公开(公告)日：2018-07-10

申请号：US29604016

申请日：2017-05-15

Applicant: Samtec, Inc.

Designer： R. Brad Bettman ,  Jean Karlo Williams Barnett ,  Jignesh H. Shah