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公开(公告)号：US10113875B2
公开(公告)日：2018-10-30
申请号：US15070943
申请日：2016-03-15
Applicant: Seiko Epson Corporation
Inventor： Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino , Michiharu Ogami
IPC: G01C19/5783
Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.
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公开(公告)号：US09541397B2
公开(公告)日：2017-01-10
申请号：US14982700
申请日：2015-12-29
Applicant: Seiko Epson Corporation
Inventor： Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino , Nobuyuki Imai
IPC: G01P15/00 , G01C19/5783 , G01P15/097 , G01P15/18 , G01P1/00 , G01P15/02
CPC classification number: G01C19/5783 , G01P1/00 , G01P15/02 , G01P15/097 , G01P15/18
Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.
Abstract translation: 传感器装置包括安装板，其具有安装有角速度传感器的第一刚性板和安装有角速度传感器的第三刚性板，以及用于固定安装板的基座。 此外，基座包括具有沿x轴和ay轴的第一固定面的基部，以及设置在基部上的突出部，并且具有沿x轴和z轴的第二固定面，以及沿着x轴和z轴的第三固定面 y轴和z轴，每个刚性板由第一固定表面，第二固定表面和第三固定表面中的至少两个支撑，并且角速度传感器具有彼此相交的各自的检测轴。
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Patent Agency Ranking
公开(公告)号：US11709079B2
公开(公告)日：2023-07-25
申请号：US17395519
申请日：2021-08-06
Applicant: Seiko Epson Corporation
Inventor： Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino
CPC classification number: G01D11/245 , G01C19/5769 , G01C21/166 , H01R12/72 , H05K1/148 , G01D11/30 , H05K2201/09163
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号：US10107653B2
公开(公告)日：2018-10-23
申请号：US14596853
申请日：2015-01-14
Applicant: Seiko Epson Corporation
Inventor： Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino
IPC: G01D11/24 , G01C19/5769 , G01C21/16 , G01D11/30
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号：US12031847B2
公开(公告)日：2024-07-09
申请号：US18307274
申请日：2023-04-26
Applicant: SEIKO EPSON CORPORATION
Inventor： Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino
CPC classification number: G01D11/245 , G01C19/5769 , G01C21/166 , H01R12/72 , H05K1/148 , G01D11/30 , H05K2201/09163
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号：US11215484B2
公开(公告)日：2022-01-04
申请号：US16743517
申请日：2020-01-15
Applicant: Seiko Epson Corporation
Inventor： Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino
IPC: G01D11/24 , G01C19/5769 , G01D11/30 , G01C21/16
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号：US10072954B2
公开(公告)日：2018-09-11
申请号：US14971007
申请日：2015-12-16
Applicant: Seiko Epson Corporation
Inventor： Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino , Michiharu Ogami
CPC classification number: G01D11/30 , G01C19/5783 , G01D11/245 , G01P1/00 , G01P1/02 , G01P1/023 , G01P1/026 , G01P15/18
Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.
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