公开(公告)号：US20250119985A1

公开(公告)日：2025-04-10

申请号：US18897107

申请日：2024-09-26

Applicant: SEMES CO., LTD.

Inventor： Ju Mi LEE ,  Jae Oh BANG ,  Min Young KIM

IPC: H05B3/28 ,  H05B3/12

Abstract: Disclosed is a heating plate for supporting and heating a substrate, the heating plate including: a base layer on which a substrate is seated; a heating wire layer located under the base layer and including a transition metal material and a metal bond; and a protective layer located under the heating wire layer and including a ceramic material and an additive material, in which the additive material is melted at a lower temperature than the ceramic material and the transition metal material, and the metal bond is a material produced by bonding of components contained in the transition metal material and the additive material.

公开(公告)号：US20210013029A1

公开(公告)日：2021-01-14

申请号：US16920418

申请日：2020-07-02

Applicant: SEMES CO., LTD.

Inventor： Do Yeon KIM ,  Se Hoon OH ,  Won Geun KIM ,  Ju Mi LEE ,  Ho Jong HWANG ,  Pil Kyun HEO ,  Hyun YOON ,  Choong Hyun LEE ,  Hyun Goo PARK

IPC: H01L21/02 ,  H01L21/67

Abstract: Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive member is made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.

公开(公告)号：US20250149374A1

公开(公告)日：2025-05-08

申请号：US18812989

申请日：2024-08-22

Applicant: SEMES CO., LTD.

Inventor： Jae Oh BANG ,  Min Young KIM ,  Ju Mi LEE

IPC: H01L21/687 ,  H01L21/67

Abstract: The present disclosure provides a vacuum hole connector, a substrate support, and a substrate treatment apparatus. A vacuum hole connector according to an embodiment of the present disclosure includes a first connection member fixed to a lower portion of a first vacuum hole of a heating plate, and in which a first connection hole is formed; and a second connection member installed in a second vacuum hole of a heater cup, attached to the first connection member, and in which a second connection hole is formed, wherein the first connection member and the second connection member include a metal material, and the first vacuum hole communicates with the second vacuum hole through the first connection hole and the second connection hole, when the first connection member and the second connection member are assembled.

公开(公告)号：US20250096496A1

公开(公告)日：2025-03-20

申请号：US18803641

申请日：2024-08-13

Applicant: SEMES CO., LTD.

Inventor： Jae Oh BANG ,  Min Young KIM ,  Ju Mi LEE ,  Seung Hwan LEE

IPC: H01R13/187 ,  H01L21/687 ,  H01R13/24 ,  H01R107/00

Abstract: An electrical terminal connector, a substrate support, and a substrate processing apparatus are provided. The electrical terminal connector includes a housing unit installed by penetrating through a heater cup and having a housing ring, and a terminal connection unit installed to reciprocate within the housing unit and having a terminal connection portion to or from which an electric terminal is attached and detached. The terminal connection portion is variable so that the electric terminal is insertable when the terminal connection portion is separated from the housing ring and the electric terminal is fixed when the terminal connection portion is inserted into the housing ring together with the inserted electric terminal.

公开(公告)号：US20230408200A1

公开(公告)日：2023-12-21

申请号：US18143273

申请日：2023-05-04

Applicant: SEMES CO., LTD.

Inventor： Ju Mi LEE ,  Gyeong Won SONG ,  Min Hee CHO ,  Byung Hwi KIM ,  Chun Woo PARK ,  Hee Man AHN

IPC: F27D9/00 ,  G03F7/40

CPC classification number: F27D9/00 ,  G03F7/40 ,  F27D2009/0078

Abstract: The substrate processing apparatus of the present invention comprises a hot plate for heating a substrate; and a cooling unit for cooling the hot plate; wherein the cooling unit includes a support plate having a space formed between the support plate and the hot plate, and a plurality of nozzles installed on the support plate and for supplying cooling gas to a bottom surface of the hot plate, wherein an outdoor air inlet passage provided in a through structure is provide in the support plate, wherein a portion of the outdoor air inlet passage forms a first region, through which a cable passes, and the remaining portion forms a second region, through which the cable does not pass and outdoor air introduces.

公开(公告)号：US20250096028A1

公开(公告)日：2025-03-20

申请号：US18810699

申请日：2024-08-21

Applicant: SEMES CO., LTD.

Inventor： Ju Mi LEE ,  Min Young KIM ,  Jae Oh BANG ,  Yun Hwa HONG

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a substrate treating apparatus including: a heating unit including a heating plate for supporting and heating a substrate; and a pressure reducing unit for applying a vacuum pressure to a space between a top surface of the heating plate and a substrate supported on the heating plate, in which the heating plate is provided with a lift hole, which is a movement passage for a lift pin to lift the substrate supported on the heating plate, and a top end of the lift hole is provided at a position higher than the top surface of the heating plate.

公开(公告)号：US20240222165A1

公开(公告)日：2024-07-04

申请号：US18539634

申请日：2023-12-14

Applicant: SEMES CO., LTD.

Inventor： Hee Man AHN ,  Gyeong Won SONG ,  Min Hee CHO ,  Ju Mi LEE ,  Byung Hwi KIM ,  Chun Woo PARK

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67225 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67098 ,  H01L21/67742

Abstract: The inventive concept provides a substrate treating apparatus which is cool a support plate having a heater faster than a conventional substrate treating apparatus. The substrate treating apparatus includes a housing providing a treating space therein; and a support unit configured to support a substrate at the treating space. The support unit includes a heater member provided at the support plate to heat the substrate and a cooling unit configured to cool the heater member. The cooling unit includes a first gas supply nozzle positioned under an edge of the heater member for supplying a cooling gas to a center direction of a bottom surface of the heater member and a second gas supply nozzle positioned under a center of the heater member for supplying the cooling gas in an edge direction of the bottom surface of the heater member.